Method for fabricating metal-oxide semiconductor transistor

1. A method for fabricating a metal-oxide semiconductor (MOS) transistor, comprising:

providing a semiconductor substrate;

forming a silicon layer on the semiconductor substrate;

performing a first photo-etching process on the silicon layer for forming a gate pattern;

forming an epitaxial layer in the semiconductor substrate adjacent to two sides of the gate pattern; and

after forming the epitaxial layer, performing a second photo-etching process on the gate pattern to form a slot in the gate pattern while using the gate pattern to physically separate the gate pattern into two gates.

2. The method of claim 1 , wherein after forming the silicon layer comprises:

forming a hard mask on the silicon layer;

performing the first photo-etching process on the hard mask and the silicon layer for forming the gate pattern;

forming a first spacer around the gate pattern;

forming a lightly doped drain in the semiconductor substrate adjacent to two sides of the gate pattern;

forming at least a recess in the semiconductor substrate adjacent to two sides of the first spacer;

forming the epitaxial layer in the recess;

removing the hard mask disposed on the silicon layer;

forming a first dielectric layer on the semiconductor substrate while covering the gate pattern;

performing the second photo-etching process on the gate pattern, the first spacer, and the first dielectric layer to form the slot in the gate pattern; and

removing a portion of the first dielectric layer for forming a second spacer.

3. The method of claim 1 , wherein the semiconductor substrate comprises at least a shallow trench isolation, and the step of forming the slot in the gate pattern further comprises removing the silicon layer disposed on the shallow trench isolation.

4. The method of claim 1 , wherein the hard mask comprises silicon nitride.

5. The method of claim 2 , wherein the step of forming the first spacer comprises:

forming a silicon oxide layer and a silicon nitride layer on the semiconductor substrate; and

etching back the silicon oxide layer and the silicon nitride layer for forming the first spacer.

6. The method of claim 2 , wherein the first dielectric layer comprises a silicon oxide layer and a silicon nitride layer.

7. The method of claim 2 , wherein after performing the second photo-etching process comprises:

forming a second dielectric layer on the semiconductor substrate; and

removing a portion of the first dielectric layer and the second dielectric layer for forming the second spacer.

8. The method of claim 7 , wherein the first dielectric layer comprises a silicon oxide layer and the second dielectric layer comprises a silicon nitride layer.

9. The method of claim 2 , wherein after forming the second spacer comprises:

forming a second dielectric layer on the semiconductor substrate; and

removing a portion of the second dielectric layer for forming a third spacer.

10. The method of claim 9 , wherein the first dielectric layer comprises a silicon oxide layer and the second dielectric layer comprises a silicon nitride layer.