Plasma processing apparatus and operational method thereof
View Patent ↗A plasma processing apparatus includes: a detector configured to detect a change in an intensity of light emission from plasma formed inside a processing chamber; and a unit configured to adjust conditions for forming the plasma or processing a wafer arranged inside the processing chamber using an output from the detector, wherein the detector detects a signal of the intensity of light emission at plural time instants before an arbitrary time instant during processing, and wherein the adjusting unit removes the component of a temporal change of a long cycle of the intensity of light emission from this detected signal and detects the component of a short temporal change of the intensity of light emission, and adjusts the conditions for forming the plasma or processing a wafer arranged inside the processing chamber based on the short temporal change of the detected intensity of light emission.
1. A plasma processing apparatus, comprising:
a processing chamber disposed inside a vacuum vessel, the processing chamber being configured to host hold a wafer for processing using a plasma therein;
a detector configured to detect an intensity of light emission from the plasma at a plurality of time intervals before a time instant during the processing;
a first filter configured to reduce noise components from a signal indicating the intensity of light emission from the plasma inside the processing chamber which is detected by the detector;
a second filter configured to reduce changing change components from the signal, the change components being associated with a change occurring for a period longer than a predetermined period, the change pertaining to state of a film to be processed or the state of particles in plasma or the state inside the processing chamber; and
a determination unit configured to use the signal to determine whether the processing is complete.
2. The plasma processing apparatus according to claim 1 , wherein the second filter is an infinite impulse response filter.
3. The plasma processing apparatus according to claim 2 , wherein the first filter is an infinite impulse response filter.
4. The plasma processing apparatus according to claim 1 , wherein the second filter is a Kalman filter.
5. The plasma processing apparatus according to claim 4 , wherein the first filter is a Kalman filter.
6. The plasma processing apparatus according to claim 1 , wherein the first filter is a Kalman filter using a higher extrapolation order than an extrapolation order of the second filter and the second filter is a Kalman filter using a lower extrapolation order than the extrapolation order of the first filter.