IP Library Granted Patent US 9,257,542
Granted Patent B2
US 9,257,542 · App. 14/336,774 · Granted Feb 9, 2016

Power semiconductor device with resistance control structure

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Quick Facts
Patent No.
US 9,257,542
App. No.
14/336,774
Granted
Feb 9, 2016
Kind
B2
Abstract

A power semiconductor device includes a resistance control structure disposed in a central portion of a semiconductor substrate having a resistance to a current higher than in a peripheral portion of the substrate surrounding the central portion. The semiconductor includes a first semiconductor layer of a first conductivity type which extends laterally to run across the central portion and the peripheral portion, and a second semiconductor layer of a second conductivity type which faces the first semiconductor layer in a thickness direction and extends laterally to run across the central portion and the peripheral portion. A lifetime control layer is provided in the first semiconductor layer, extends laterally to run across the central portion and the peripheral portion and has a higher lifetime killer concentration in the central portion than the peripheral portion. The resistance control structure includes the lifetime control layer.

Claims (8)

1. A power semiconductor device comprising a semiconductor substrate in which a current flows in a thickness direction of said semiconductor substrate,

wherein said semiconductor substrate includes a resistance control structure disposed in a central portion of said semiconductor substrate having a resistance to current higher than a peripheral portion laterally surrounding said central portion of said semiconductor substrate,

wherein said semiconductor substrate includes:

a first semiconductor layer of a first conductivity type which extends laterally to run across said central portion and said peripheral portion;

a second semiconductor layer of a second conductivity type which faces said first semiconductor layer in said thickness direction and extends laterally to run across said central portion and said peripheral portion; and

a lifetime control layer provided in said first semiconductor layer and facing said second semiconductor layer in said thickness direction;

said lifetime control layer extends laterally to run across said central portion and said peripheral portion and has a higher lifetime killer concentration in said central portion than said peripheral portion; and

said resistance control structure includes said lifetime control layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2024
From: SONRAI MEMORY LIMITED
To: NERA INNOVATIONS LIMITED
Reel/Frame 066778/0178 →
NUNC PRO TUNC ASSIGNMENT Recorded Jul 8, 2020
From: ARIGNA TECHNOLOGY LIMITED
To: SONRAI MEMORY LIMITED
Reel/Frame 053147/0767 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2020
From: MITSUBISHI ELECTRIC CORPORATION
To: ARIGNA TECHNOLOGY LIMITED
Reel/Frame 052042/0651 →