Method and apparatus for reviewing defect
View Patent ↗A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.
1. A method for reviewing a defect in a sample, comprising:
imaging a surface of the sample using an arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining an image;
calculating a defect position of the surface of the sample using a defect image;
determining a defect detection accuracy of the calculated defect position; and
determining whether the defect detection accuracy meets predetermined requirement, wherein
until it is determined that the defect detection accuracy meets the predetermined requirement, the preceding steps are repeated, and
in calculating the defect position of the surface of the sample, when the image of a predetermined frame is imaged, images prior to the predetermined frame are added and averaged to obtain frame addition amounts.
2. The method according to claim 1 ,
wherein the plurality of image acquisition conditions are selected in order corresponding to a requirement time of image acquisition from shorter to longest.
3. The method according to claim 1 ,
wherein imaging the surface of the sample is based on predetermined position information on the surface of the sample.
4. The method according to claim 1 ,
wherein imaging a neighborhood area of a predetermined position coordinate on the surface of the sample.
5. The method according to claim 1 ,
wherein the plurality of the image acquisition conditions are generated by a combination of different frame addition amounts or different image sizes.
6. The method according to claim 1 ,
wherein imaging, calculating, and determining are processed in parallel.
7. The method according to claim 3 ,
wherein imaging a non-defective image of the surface of the sample is formed in a similar pattern to a pattern of the defect position based on the predetermined position information; and
wherein calculating the defect position is performed by comparing the defect image and the non-defective image.
8. The method according to claim 1 ,
wherein a non-defective image is obtained by averaging a plurality of images obtained by imaging; and
wherein calculating the defect position is performed by comparing the defect image and the non-defective image.
9. The method according to claim 1 ,
wherein imaging a neighborhood area of the defect position is performed again by higher-resolution than a resolution of the imaging when the accuracy meets the predetermined requirement.
10. An apparatus for reviewing defect, comprising:
a Scanning Electron Microscope (SEM), wherein the SEM
images a surface of a sample using arbitrary image acquisition conditions selected from a plurality of image acquisition conditions and obtaining an image;
calculates a defect position of the surface of the sample using the defect image;
detects a defect detection accuracy of the calculated defect position; and
determines whether the defect detection accuracy meets predetermined requirement, wherein
when the defect detection accuracy does not meet the predetermined requirement the preceding actions of the SEM are repeated, and
in calculating the defect position of the surface of the sample, when the image of a predetermined frame is imaged, images prior to the predetermined frame are added and averaged to obtain frame addition amounts.
11. The apparatus according to claim 10 ,
wherein the plurality of image acquisition conditions are selected in order corresponding to a requirement time of image acquisition from shorter to longest.
12. The apparatus according to claim 10 ,
wherein imaging the surface of the sample is based on predetermined position information on the surface of the sample.
13. The apparatus according to claim 12 ,
wherein the SEM images a neighborhood area of a predetermined position coordinate on the surface of the sample.
14. The apparatus according to claim 10 ,
wherein the plurality of the image acquisition conditions are generated by a combination of different frame addition amounts or different image sizes.
15. The apparatus according to claim 10 ,
wherein the SEM processes in parallel the imaging, calculating, and the determining.
16. The apparatus according to claim 12 ,
wherein imaging a non-defective image of the surface of the sample is formed in a similar pattern to a pattern of the position based on the predetermined position information; and
wherein calculating the position is performed by comparing the defect image and the non-defective image.
17. The apparatus according to claim 10 ,
wherein a non-defective image is obtained by averaging a plurality of images obtained by imaging; and
wherein calculating the defect position is performed by comparing the defect image and the non-defective image.