Jig for manufacturing capacitor element and method for manufacturing capacitor element
View Patent ↗A jig for manufacturing a capacitor element is provided in which the productive efficiency is excellent due to a larger number of anode bodies that can be processed, and an immersion position (height) of the anode body with respect to the processing liquid can be controlled with high accuracy. A jig 10 according to the invention includes a substrate 11 , a plurality of beam members 8 arranged on at least one surface of the substrate in parallel to each other, and a plurality of conductive sockets 1 mounted on the beam member 8 . The plurality of sockets 1 are capable of electrically connecting to a power source supplying an electric current to a capacitor anode body. The socket 1 is provided with an insertion port 37 for electrically connecting a lead wire of a capacitor anode body, and the insertion port 37 is opened in a downward direction of the substrate 11.
1. A jig for manufacturing a capacitor element, comprising:
a substrate;
a plurality of beam members arranged on at least one surface of the substrate in parallel to each other; and
a plurality of conductive sockets mounted on the beam member,
wherein the plurality of sockets are capable of being electrically connected to a power source supplying an electric current to a capacitor anode body, and
wherein the socket is provided with an insertion port for a lead wire of a capacitor anode body for use in electrically connecting the lead wire to the socket, the insertion port being opened in a downward direction of the substrate.
2. The jig for manufacturing a capacitor element as recited in claim 1 , wherein the beam member is 1.6 mm to 5.1 mm in width and 2 mm to 10 mm in height.
3. The jig for manufacturing a capacitor element as recited in claim 1 , wherein the beam member contains hard resin.
4. The jig for manufacturing a capacitor element as recited in claim 1 ,
wherein the power source is an electric circuit formed on at least one surface of the substrate, and
wherein each socket is electrically connected to respective power sources, and is electrically insulated with each other except that the socket is connected to the power source.
5. The jig for manufacturing a capacitor element as recited in claim 4 , wherein the electric circuit is a constant current circuit.
6. The jig for manufacturing a capacitor element as recited in claim 4 , wherein the electric circuit is also a circuit for limiting a voltage every socket.
7. A method for manufacturing a capacitor element, comprising:
a dielectric layer forming step of forming a dielectric layer on a surface of an anode body by energizing the anode body as an anode in a state in which the capacitor anode body is connected to the socket of the jig for manufacturing a capacitor element as recited in claim 1 , the substrate is held horizontally with both longitudinal edge portions of the beam member gripped, and the anode body is immersed in a chemical conversion treatment solution.
8. A method for manufacturing a capacitor element, comprising:
a semiconductor layer forming step of forming a semiconductor layer on a surface of a dielectric layer on a surface of an anode body by energizing the anode body as an anode in a state in which the capacitor anode body is connected to the socket of the jig for manufacturing a capacitor element as recited in claim 1 , the substrate is held horizontally with both longitudinal edge portions of the beam member gripped, and the anode body is immersed in a semiconductor layer forming solution.
9. A method for manufacturing a capacitor element, comprising:
a dielectric layer forming step of forming a dielectric layer on a surface of an anode body by energizing the anode body as an anode in a state in which the capacitor anode body is connected to the socket of the jig for manufacturing a capacitor element as recited in claim 1 , the substrate is held horizontally with both longitudinal edge portions of the beam member gripped, and the anode body is immersed in a chemical conversion treatment solution,
a semiconductor layer forming step of forming a semiconductor layer on a surface of a dielectric layer on a surface of the anode body by energizing the anode body as an anode in a state in which after the dielectric layer forming step, the substrate in a state in which the anode body is connected to the socket is held horizontally, and the anode body is immersed in a semiconductor layer forming solution.
10. A method for manufacturing a capacitor in which the anode body and the semiconductor layer of the capacitor element obtained by the manufacturing method as recited in claim 7 are electrically connected to electrode terminals respectively and sealed except for a part of the electrode terminal remained.