Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body
Provided are an electron beam curable resin composition including polymethylpentene, and a crosslinking agent, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and a molecular weight is 1,000 or less, a resin frame for reflectors using the resin composition, a reflector, and a molding method using the resin composition.
1. A reflector, comprising:
a cured product of an electron beam curable resin composition comprising:
polymethylpentene;
a crosslinking agent; and
white pigment,
wherein the crosslinking agent is expressed by the following Formula (1)
wherein in the Formula (1), R1 to R3 are each independently any allylic substituent of an allyl group, a methallyl group, an allyl group through ester bonding, and a methallyl group through ester bonding,
a molecular weight is 1,000 or less, and
wherein an average particle size of the white pigment is 0.21 μm to 0.50 μm,
wherein a reflectivity of the reflector is 83% or more as measured at wave length of 450 nm using a spectroscopic photometer after exposure to a temperature of 150° C. for between 24 hours and 500 hours.
2. The reflector according to claim 1 , further comprising inorganic particles other than the white pigment.
3. The reflector according to claim 2 , wherein the inorganic particles other than the white pigment are spherical fused silica particles and/or modified cross-section glass fibers.
4. The reflector according to claim 3 , wherein the inorganic particles other than the white pigment is modified cross-section glass fibers.
5. The reflector according to claim 3 , wherein the inorganic particles other than the white pigment is spherical fused silica particles which has a volume average particle size of from 0.1 to 500 μm.
6. The reflector according to claim 1 ,
wherein 0.1 parts by mass to 15 parts by mass of the crosslinking agent is blended with respect to 100 parts by mass of polymethylpentene.
7. The reflector according to claim 1 ,
wherein a thickness is 0.1 mm to 3.0 mm.
8. A method for producing a molded body comprising:
an injection molding process of performing injection molding on the electron beam curable resin composition according to claim 1 at an injection temperature of 200° C. to 400° C. and at a mold temperature of 20° C. to 100° C.; and
an electron beam irradiation process of performing electron beam irradiation treatment before and after the injection molding process.
9. The reflector according to claim 1 , wherein the crosslinking agent expressed by the above Formula (1) includes triallyl isocyanurate.
10. A method of reflecting light from the optical semiconductor element by the reflector according to claim 1 , comprising:
reflecting, by the reflector, light from the optical semiconductor element to a predetermined direction;
wherein at least a portion of a light reflective surface of the reflector is made of the cured product of the electron beam curable resin composition.
11. The reflector according to claim 1 , wherein a light reflectivity of the reflector is 95% or more prior to exposure to the temperature of 150° C.
12. A semiconductor light emitting device comprising:
an optical semiconductor element; and
a reflector which is provided in the vicinity of the optical semiconductor element and reflects light from the optical semiconductor element in a predetermined direction,
wherein the optical semiconductor element and the reflector are provided on a substrate, and
at least a part of the light reflecting surface of the reflector is composed of a cured product of the electron beam curable resin composition, the resin composition comprising:
polymethylpentene;
a crosslinking agent; and
white pigment,
wherein the crosslinking agent is expressed by the following Formula (1)
wherein in the Formula (1), R 1 to R 3 are each independently any allylic substituent of an allyl group, a methallyl group, an allyl group through ester bonding, and a methallyl group through ester bonding, and
a molecular weight is 1,000 or less, and
wherein an average particle size of the white pigment is 0.21 μm to 0.50 μm,
wherein a reflectivity of the reflector is 83% or more as measured at a wavelength of 450 nm using a spectroscopic photometer after exposure to a temperature of 150° C. for between 24 hours and 500 hours.