Method for producing a data carrier that prevents mechanical strains between chip and data carrier body

1. A method for manufacturing a portable data carrier having the method steps of:

making available a data carrier body, wherein the data carrier body includes at least a carrier layer and a core layer, the core layer defines a gap for receiving a chip, the chip having a first side provided with first electroconductive contact points;

applying an adhesive to a first segment of the carrier layer exposed by the gap, said first segment being provided with second electroconductive contact points;

incorporating a chip into the gap such that the first electroconductive contact points of the chip contact the second electroconductive contact points of the first segment of the carrier layer, the adhesive securing the chip to the carrier layer on the first side of the chip;

applying a stabilizing agent into the gap of the core layer on a second side of the chip opposite the first side, wherein the stabilizing agent is applied by printing technology;

laying a cover layer on the data carrier body;

laminating the data carrier body and the cover layer, wherein during the lamination the stabilizing agent is compressed around the chip and the contact points, so that the chip remains free from direct rigid connection to the core layer and the cover layer;

curing the stabilizing agent after the step of laminating the data carrier body and the cover layer; and

wherein after the step of curing the stabilizing agent, the chip is only directly elastically connected to the core layer and the cover layer.

2. The method according to claim 1 , wherein the stabilizing agent is applied above the chip into the gap.

3. The method according to claim 1 , wherein the stabilizing agent is arranged on the cover layer and is applied into the gap while the cover layer is being laid on the core layer.

4. The method according to claim 1 , wherein the stabilizing agent is only activated after the step of the lamination.

5. The method according to claim 1 , wherein a coil was laid on the carrier layer and this coil is electroconductively connected with the chip upon the step of laying the chip on the carrier layer.

6. The method according to claim 1 , wherein the carrier layer, the core layer and the cover layer form an inlay for a data carrier and further overlay layers are laid on.

7. A data carrier body consisting of a carrier layer, a core layer and at least one cover layer, wherein:

the core layer defines a gap in which a chip is arranged, the chip having a first side provided with first electroconductive contact points and a first segment of the carrier layer exposed by the gap being provided with second electroconductive contacts,

wherein the chip is arranged in the gap such that the first electroconductive contact points of the chip contact the second electroconductive contact points of the first segment of the carrier layer and an adhesive directly connects the chip and the carrier layer on the first side of the chip;

the carrier layer, core layer and cover layer are interconnected by lamination,

wherein within the gap there is arranged a stabilizing agent which covers the chip on an upper side before the lamination and the stabilizing agent is flexible before and during the lamination and activatable after the lamination, so that the chip remains free from direct rigid connection to the core layer and the cover layer such that no mechanical tensions from the lamination are frozen in the stabilizing agent surrounding the chip;

wherein after the step of curing the stabilizing agent, the chip is only directly elastically connected to the core layer and the cover layer.

8. The data carrier body according to claim 7 , wherein the stabilizing agent is activatable by a radiation.

9. The data carrier body according to claim 7 , wherein the stabilizing agent is a water-based and/or solvent-based lacquer.

10. The data carrier body according to claim 7 , wherein the stabilizing agent is a water-based and/or solvent-based contact adhesive.

11. The data carrier body according to claim 7 , wherein the stabilizing agent is a multi-component system contact adhesive.

12. The data carrier body according to claim 7 , wherein the stabilizing agent is a hot-melt agent adhesive.

13. A method for manufacturing a portable data carrier having the method steps of:

making available a data carrier body, wherein the data carrier body includes at least a carrier layer and a core layer, the core layer defines a gap for receiving a chip, the chip having a first side provided with first electroconductive contact points;

applying an adhesive to a first segment of the carrier layer exposed by the gap, said first segment being provided with second electroconductive contact points;

incorporating a chip into the gap such that the first electroconductive contact points of the chip contact the second electroconductive contact points of the first segment of the carrier layer, the adhesive being between the chip and the carrier layer;

arranging a stabilizing agent on the cover layer in exact register and applying the stabilizing agent in exact register only into the gap of the core layer while the cover layer is being laid directly on the core layer;

laying a cover layer on the data carrier body;

laminating the data carrier body and the cover layer, wherein during the lamination the stabilizing agent is compressed around the chip and the contact points, so that the chip remains flexible in the data carrier body; and

curing the stabilizing agent after the step of laminating the data carrier body and the cover layer,

wherein the stabilizing agent is a first component of a multi-component contact adhesive, and wherein a second component of the multi-component contact adhesive is applied on a second side of the chip opposite the first side such that the first and second components mix upon the step of laying the cover layer on the data carrier body.