Processability of polymeric substrates and related methods
View Patent ↗The invention discloses a method for adhering a metal layer to a polymer substrate. The metal layer is deposited on a sacrificial substrate of a mold to form part of an interior surface of the mold, and a solution of monomers is deposited on the metal layer. The monomers are then polymerized together to form the polymer substrate on the metal layer. Then the polymer substrate is removed from the mold such that the metal layer is removed from the mold and adhered to the polymer substrate.
1. A method for adhering a metal layer to a polymer substrate, comprising:
depositing the metal layer on a sacrificial substrate of a mold to form part of an interior surface of the mold;
depositing a solution of monomers on the metal layer, wherein:
the solution of monomers consists of: a free radical initiator, thiol monomers with two or more thiol functional groups, and, vinyl monomers with two or more vinyl functional groups, acrylate monomers with two or more vinyl functional groups, acrylate monomers with two or more vinyl functional groups and acrylate co-monomers with one vinyl functional group, or with both the vinyl monomers and the acrylate monomers, and
a total number of the thiol functional groups and a total number the vinyl functional groups are in stoichiometric imbalance such that the total number of the thiol functional groups exceeds the total number of the vinyl functional groups to provide an excess of the thiol functional groups; and then
polymerizing the monomers together in the presence of the metal layer such that the thiol monomers and the vinyl monomers in the solution of monomers on the metal layer are polymerized together to form the polymer substrate on the metal layer and wherein the polymer substrate is chemically adhered to the metal layer; and then
removing the polymer substrate from the mold such that the metal layer is removed from the mold and adhered to the polymer substrate.
2. The method according to claim 1 , wherein the metal layer includes a layer of gold, iridium oxide, titanium nitride, or titanium oxide.
3. The method according to claim 2 , wherein the metal layer includes the layer of gold located on a layer of aluminum, chromium or titanium.
4. The method according to claim 1 , wherein the polymerizing of the monomers together forms the polymer substrate that is a thiol-ene polymer.
5. The method according to claim 1 wherein, the metal layer is lithographically patterned prior to the depositing of the solution of monomers on the metal layer of the mold.
6. The method according to claim 1 wherein, the mold is a blend of radiation crosslinked thermoplastic polymer and a polyunsaturated monomer, or, an epoxy or siloxane.
7. The method according to claim 1 , wherein the
polymerizing of the monomers together to form the polymer substrate includes forming a partially polymerized polymer substrate.
8. The method according to claim 7 , wherein the partially polymerized polymer substrate is deformed into a different shape, and then, the polymerizing of the monomers together to form the polymer substrate is completed.
9. The method according to claim 1 , wherein the acrylate co-monomers with the one vinyl functional group in the solution of monomers includes methyl acrylate and isobornyl acrylate crosslinked with the acrylate monomers with two or more vinyl functional groups of poly(ethylene glycol)diacrylate.
10. The method according to claim 9 , wherein the acrylate co-monomers with the one vinyl functional group in the solution of monomers includes 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate (2HEMA), acrylic acid or mono-2-(Methacryloyloxy)ethyl succinate.
11. The method according to claim 1 , wherein the acrylate co-monomers with the one vinyl functional group in the solution of monomers includes acrylic acid.
12. The method according to claim 11 , wherein the acrylic acid in the solution of monomers is in a concentration range from 10 wt % to 20 wt %.