Method for package-on-package assembly with wire bonds to encapsulation surface
View Patent ↗A microelectronic assembly ( 10 ) includes a substrate ( 12 ) having a first and second opposed surfaces. A microelectronic element ( 22 ) overlies the first surface and first electrically conductive elements ( 28 ) can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements ( 28 ) are electrically connected to the microelectronic element ( 22 ). Wire bonds ( 32 ) have bases ( 34 ) joined to the conductive elements ( 28 ) and end surfaces ( 38 ) remote from the substrate and the bases, each wire bond defining an edge surface ( 37 ) extending between the base and the end surface. An encapsulation layer ( 42 ) can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds ( 32 ) are defined by at least portions of the end surfaces ( 38 ) of the wire bonds that are uncovered by the encapsulation layer ( 42 ).
1. A method of making a microelectronic assembly, comprising:
a) bonding a metal wire to a conductive element exposed at a first surface of a substrate, thereby forming a base of a wire bond on the conductive element;
b) extending a length of the metal wire through a capillary of a bonding tool;
c) cutting the metal wire within the capillary at a location between a clamped portion of the metal wire within the bonding tool and the base to at least partially define an end surface of the wire bond at a predetermined distance from the base of the wire bond;
d) forming an end portion at the end surface having a cross-section wider than a cross-section of the wire bond; and
e) forming a dielectric encapsulation layer overlying the first surface of the substrate and defining a major surface spaced apart from the first surface, wherein the encapsulation layer is formed so as to at least partially cover the first surface of the substrate and a portion of the wire bond, such that an unencapsulated portion of the wire bond is defined by a portion of the end portion,
wherein the wire bond has a first edge surface defined between the base and the end portion, the end portion has a second edge surface that extends outward from the first edge surface of the wire bond below the major surface of the dielectric encapsulation layer, and the dielectric encapsulation layer surrounds the second edge surface.
2. The method of claim 1 , wherein the end portion has a substantially rounded configuration.
3. The method of claim 1 , wherein the end portion has a ball shape.
4. The method of claim 1 , wherein the cutting is performed before the forming of the end portion.