IP Library Granted Patent US 9,150,727
Granted Patent B2
US 9,150,727 · App. 14/386,189 · Granted Oct 6, 2015

Compositions comprising resin-linear organosiloxane block copolymers and organopolysiloxanes

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Quick Facts
Patent No.
US 9,150,727
App. No.
14/386,189
Granted
Oct 6, 2015
Kind
B2
Abstract

Resin-linear organosiloxane block copolymers combined with linear or resin organopolysiloxane components are disclosed. In some embodiments, the combination of resin-linear organosiloxane block copolymers with linear or resin organopolysiloxane components provides compositions having improved physical properties, such as improved toughness and flow behavior.

Claims (84)

1. A composition comprising:

A) one or more resin-linear organosiloxane block copolymer compositions comprising:

40 to 90 mole percent disiloxy units of the formula [R 1 2 SiO 2/2 ],

10 to 60 mole percent trisiloxy units of the formula [R 2 SiO 3/2 ],

0.5 to 35 mole percent silanol groups [≡SiOH];

wherein:

each R 1 , at each occurrence, is independently a C 1 to C 30 hydrocarbyl,

R 2 , at each occurrence, is independently a C 1 to C 20 hydrocarbyl;

wherein:

the disiloxy units [R 1 2 SiO 2/2 ] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R 1 2 SiO 2/2 ] per linear block,

the trisiloxy units [R 2 SiO 3/2 ] are arranged in non-linear blocks having a molecular weight of at least 500 g/mole, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and

the organosiloxane block copolymer has a weight average molecular weight (M w ) of at least 20,000 g/mole; and

B) at least one of a phenyl silsesquioxane resin and a polydiorganosiloxane;

wherein the weight ratio of component A) to component B) may vary from 99.5/0.5 to 10/90.

2. The composition of claim 1 , wherein the weight ratio of component A) to component B) is about 99.5/0.5.

3. The composition of claim 1 , wherein the phenyl silsesquioxane resin comprises at least 60 mole percent of (C 6 H 5 )SiO 3/2 siloxy units.

4. The composition of claim 1 , wherein the phenyl silsesquioxane resin consists essentially of (C 6 H 5 )SiO 3/2 siloxy units.

5. The composition of claim 1 , wherein the polydiorganosiloxane is polymethylphenylsiloxane.

6. The composition of claim 1 , wherein the polydiorganosiloxane has the formula

(CH 3 ) 3 SiO[(CH 3 ) 2 SiO] m Si(CH 3 ) 3

wherein m is ≧1.

7. The composition of claim 6 , wherein m is an integer from 1 to 200.

8. The composition of claim 1 , wherein the polydiorganosiloxane has the formula

(CH 3 ) 3 SiO[(C 6 H 5 )(CH 3 )SiO] m Si(CH 3 ) 3

wherein m is ≧1.

9. The composition of claim 1 , wherein the polydiorganosiloxane has the formula

(CH 3 )(C 6 H 5 ) 2 SiO[(C 6 H 5 )(CH 3 )SiO] m Si(C 6 H 5 ) 2 (CH 3 )

wherein m is ≧1.

10. The composition of claim 1 , wherein the polydiorganosiloxane has the formula

(CH 3 )(C 6 H 5 )(OH)SiO[(C 6 H 5 )(CH 3 )SiO] m Si(OH)(C 6 H 5 )(CH 3 )

wherein m is ≧1.

11. The composition of claim 1 , wherein the polydiorganosiloxane has the formula

(CH 3 ) 2 (OH)SiO[(C 6 H 5 )(CH 3 )SiO] m Si(OH)(CH 3 ) 2

wherein m is ≧1.

12. The composition of claim 1 , wherein A) and/or B) further comprises a solvent.

13. The composition of claim 1 , wherein B) the organopolysiloxane is a cyclic polydiorganosiloxane.

14. The composition of claim 13 , wherein the cyclic polydiorganosiloxane has the formula:

wherein each R 1 , at each occurrence, is independently a C 1 to C 30 hydrocarbyl.

15. The composition of claim 14 , wherein each R 1 , at each occurrence, is independently methyl or phenyl.

16. A solid film composition comprising a curable composition of claim 15 .

17. The cured product of composition of claim 16 .

18. The solid film compositions of claim 16 , wherein the solid composition has an optical transmittance of at least 95%.

19. The composition of claim 1 , wherein the composition is curable.

20. An LED encapsulant comprising the compositions of claim 1 .

21. A method for increasing the flexibility of a solid resin-linear organosiloxane block copolymer composition comprising combining one or more resin-linear organosiloxane block copolymer compositions and at least one of a phenyl silsesquioxane resin and a polydiorganosiloxane,

wherein the weight ratio of the organosiloxane block copolymer composition to the organopolysiloxane may vary from 90/10 to 10/90; and

wherein the one or more resin-linear organosiloxane block copolymer compositions comprise:

40 to 90 mole percent disiloxy units of the formula [R 1 2 SiO 2/2 ],

10 to 60 mole percent trisiloxy units of the formula [R 2 SiO 3/2 ],

0.5 to 35 mole percent silanol groups [≡SiOH];

wherein:

each R 1 , at each occurrence, is independently a C 1 to C 30 hydrocarbyl,

R 2 , at each occurrence, is independently a C 1 to C 20 hydrocarbyl;

wherein:

the disiloxy units [R 1 2 SiO 2/2 ] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R 1 2 SiO 2/2 ] per linear block,

the trisiloxy units [R 2 SiO 3/2 ] are arranged in non-linear blocks having a molecular weight of at least 500 g/mole, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and

the organosiloxane block copolymer has a weight average molecular weight (M w ) of at least 20,000 g/mole.

22. A method for reducing the viscosity of a solid resin-linear organosiloxane block copolymer composition comprising combining one or more resin-linear organosiloxane block copolymer compositions and at least one of a phenyl silsesquioxane resin and a polydiorganosiloxane,

wherein the weight ratio of the organosiloxane block copolymer composition to the organopolysiloxane may vary from 90/10 to 10/90; and

wherein the one or more resin-linear organosiloxane block copolymer compositions comprise:

40 to 90 mole percent disiloxy units of the formula [R 1 2 SiO 2/2 ],

10 to 60 mole percent trisiloxy units of the formula [R 2 SiO 3/2 ],

0.5 to 35 mole percent silanol groups [≡SiOH];

wherein:

each R 1 , at each occurrence, is independently a C 1 to C 30 hydrocarbyl,

R 2 , at each occurrence, is independently a C 1 to C 20 hydrocarbyl;

wherein:

the disiloxy units [R 1 2 SiO 2/2 ] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R 1 2 SiO 2/2 ] per linear block,

the trisiloxy units [R 2 SiO 3/2 ] are arranged in non-linear blocks having a molecular weight of at least 500 g/mole, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and

the organosiloxane block copolymer has a weight average molecular weight (M w ) of at least 20,000 g/mole.

23. A method for reducing the storage modulus of a solid resin-linear organosiloxane block copolymer composition comprising combining one or more resin-linear organosiloxane block copolymer compositions and at least one of a phenyl silsesquioxane resin and a polydiorganosiloxane,

wherein the weight ratio of the organosiloxane block copolymer composition to the organopolysiloxane may vary from 90/10 to 10/90; and

wherein the one or more resin-linear organosiloxane block copolymer compositions comprise:

40 to 90 mole percent disiloxy units of the formula [R 1 2 SiO 2/2],

10 to 60 mole percent trisiloxy units of the formula [R 2 SiO 3/2 ],

0.5 to 35 mole percent silanol groups [≡SiOH];

wherein:

each R 1 , at each occurrence, is independently a C 1 to C 30 hydrocarbyl,

R 2 , at each occurrence, is independently a C 1 to C 20 hydrocarbyl;

wherein:

the disiloxy units [R 1 2 SiO 2/2 ] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R 1 2 SiO 2/2 ] per linear block,

the trisiloxy units [R 2 SiO 3/2 ] are arranged in non-linear blocks having a molecular weight of at least 500 g/mole, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and

the organosiloxane block copolymer has a weight average molecular weight (M w ) of at least 20,000 g/mole.

24. The method of claim 23 , wherein the storage modulus is reduced to a value ranging from about 0.5 to about 50 kPa.

Assignments (2)
CHANGE OF NAME Recorded Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2014
From: HORSTMAN, JOHN BERNARD; SWIER, STEVEN
To: DOW CORNING CORPORATION
Reel/Frame 034573/0152 →