Method for forming TiSiN thin film layer by using atomic layer deposition
There is disclosed a method for forming a TiSiN thin film on a substrate according to ALD including a first process of preheating a substrate while supplying Ar or N 2 containing inert gas to a chamber, after disposing a substrate in a chamber; a second process of forming a TiN film on the substrate by repeating at least one time a process of purging over-supplied Ti containing gas after supplying Ti containing gas and inert gas after that and a process of purging residual product after supplying N containing gas and inert gas after that; a third process of forming a SiN film by repeating at least one time a process of purging over-supplied Si containing gas after supplying Si containing gas on the TiN film and supplying inert gas after that and a process of purging residual product after supplying N containing gas and supplying inert gas after that; and a fourth process of forming a TiSiN film having a desired thickness by repeating the second and third processes at least one time, a partial pressure range of the gas used in forming the TiSiN thin film is Ti containing gas: 9×10 −3 Torr or less, Si containing gas: 1×10 −3 ˜3×10 −1 Torr and N containing gas: 7×10 −3 ˜6×10 −1 Torr, and a pressure range of the gas is 500 mTorr˜5 Torr and the Si content of the formed TiSiN thin film is 20 atom % or less.
1. A method for forming a TiSiN thin film on a substrate according to atomic layer deposition (ALD), the method comprising:
a first process of preheating the substrate while supplying Ar or N 2 containing inert gas to a chamber, the first process performed after disposing the substrate in the chamber;
a second process of forming a TiN film on the substrate, the second process comprising a first plurality of steps:
supplying Ti containing gas for a predetermined time,
purging oversupplied Ti containing gas by supplying an inert gas for a predetermined time after that,
supplying N containing gas for a predetermined time after that,
purging oversupplied residual products with an inert gas for a predetermined time after that;
a third process of forming a SiN film, the third process comprising a second plurality of steps:
supplying Si containing gas on the thin film for a predetermined time,
purging oversupplied Si containing gas by supplying an inert gas for a predetermined time after that,
supplying N containing gas for a predetermined time after that,
purging residual products with an inert gas after that; and
a fourth process of forming a TiSiN film having a desired thickness by repeating the second and third processes at least one time,
wherein a partial pressure range of the gas used in forming the TiSiN thin film is Ti containing gas: 9×10 −3 Torr or less, Si containing gas: 1×10 −3 Torr to 3×10 −1 Torr and N containing gas: 7×10 −3 Torr to 6×10 −1 Torr, and a pressure range of the gas is 500 mTorr to 5 Torr and the Si content of the formed TiSiN thin film is 20 atom % or less,
the method characterized in that in the second process, the first plurality of steps are repeated at least one time prior to the third process, and that in the third process, the second plurality of steps are repeated at least one time prior to the fourth process.
2. The method of claim 1 , wherein the Ti containing gas is TiCl 4 , TDMAT or TDEAT.
3. The method of claim 1 , wherein the Si containing gas is SiH 2 Cl 2 , SiHCl 3 , SiCl 4 , SiH 4 or Si 2 H 6 .
4. The method of claim 1 , wherein the N containing gas is NH 3 or MMH.
5. The method of claim 1 , wherein a preheating temperature in the first process is maintained in a range from 400° C. to 700° C. and a preheating pressure in the first process is maintained in a range from 0.5 mTorr to 5Torr.
6. The method of claim 1 , wherein a partial pressure of the Ti containing gas is 6×10 −4 Torr or less.
7. The method of claim 1 , wherein a temperature of a bubbler in a supply of the Ti containing gas is maintained in a range from 0° C. to 15° C.