IP Library Granted Patent US 9,791,380
Granted Patent B2
US 9,791,380 · App. 14/391,338 · Granted Oct 17, 2017

Inspection device and image capture element

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Quick Facts
Patent No.
US 9,791,380
App. No.
14/391,338
Granted
Oct 17, 2017
Kind
B2
Abstract

An imaging device includes multiple sensor pixels that are arranged in a predetermined direction, each sensor pixel having multiple sensor pixel borders defining an outer edge part of the sensor pixel, among which at least one of a pair of sensor pixel borders that are opposed in the arrangement direction is oblique to a passage direction of a defect image that is vertical to the predetermined direction. This can provide an inspection tool enabling high sensitivity inspection and/or having improved detection reproducibility of a defect.

Claims (44)

1. An inspection tool, comprising:

illumination optics configured to supply inspection light to a sample to define an illumination area on the sample;

an imaging device configured to detect light from the sample; and

a processor, wherein:

the imaging device includes multiple sensor pixels that are arranged in a direction substantially vertical to a main scanning direction of the illumination area on the sample,

a pair of sensor pixel borders opposed in the pixel arrangement direction are oblique to the main scanning direction, and

the processor is configured to:

determine whether a detection signal waveform from the multiple sensor pixels includes a peak, and

acquire a position of a defect on the sample based on a detection signal waveform determined to include a peak.

2. The inspection tool according to claim 1 , wherein

the processor acquires a position of the defect based on correlation of the detection signal waveform.

3. The inspection tool according to claim 2 , wherein

the processor acquires a position of the defect in the primary scanning direction based on a sampling rate and a sampling timing when the detection signal waveform is extracted.

4. The inspection tool according to claim 3 , wherein

the processor acquires a position of the defect in a secondary scanning direction based on a center position of a defect image when the detection signal waveform is obtained.

5. The inspection tool according to claim 4 , wherein

the processor acquires a variation of the correlation and changes the position of the defect in the secondary scanning direction based on the variation.

6. The inspection tool according to claim 5 , further comprising a noise removal unit configured to remove a predetermined background noise component from an output signal of the sensor pixels and output the detection signal waveform.

7. The inspection tool according to claim 6 , wherein

the output signal has a sampling rate which is given by a predetermined driving signal that is shorter than a sampling time of the defect image.

8. The inspection tool according to claim 7 , wherein

the sensor pixels have a dimension that is substantially equal to an optical resolution of a defect to be detected.

9. The inspection tool according to claim 8 , wherein

each sensor pixel has a triangle shape.

10. The inspection tool according to claim 9 , wherein

each sensor pixel has an isosceles triangle shape.

11. The inspection tool according to claim 8 , wherein

each sensor pixel has a parallelogram shape.

12. The inspection tool according to claim 1 , wherein

the processor acquires a position of a defect in the primary scanning direction based on a sampling rate and a sampling timing when the detection signal waveform is extracted.

13. The inspection tool according to claim 1 , wherein

the processor acquires a position of a defect in a secondary scanning direction based on a center position of a defect image when the detection signal waveform is obtained.

14. The inspection tool according to claim 1 , wherein

the processor uses a variation of correlation of the detection signal waveform to change a position of a defect in a secondary scanning direction.

15. The inspection tool according to claim 1 , further comprising a noise removal unit configured to remove a predetermined background noise component from an output signal of the sensor pixels and output the detection signal waveform.

16. The inspection tool according to claim 1 , wherein an output signal of the sensor pixels has a sampling rate which is given by a predetermined driving signal that is shorter than a sampling time of a defect image.

17. The inspection tool according to claim 1 , wherein

the sensor pixels have a dimension that is substantially equal to an optical resolution of a defect to be detected.

18. The inspection tool according to claim 1 , wherein

each sensor pixel has a triangle shape.

19. The inspection tool according to claim 18 , wherein

each sensor pixel has an isosceles triangle shape.

20. The inspection tool according to claim 1 , wherein

each sensor pixel has a parallelogram shape.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2014
From: JINGU, TAKAHIRO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 033926/0656 →