High performance tools exhibiting reduced crater wear in particular by dry machining operations

1. Coating system deposited on a surface of a substrate comprising at least one multi-layered film formed of alternated A- and B-nanolayers deposited one on each other, wherein the A-nanolayers consist of aluminium chromium boron nitride and the B-nanolayers contain aluminium chromium nitride but not contain boron

characterized in that the A-nanolayers have a region with highest boron content and a region with lower boron content, wherein the region having lower boron content is the region which is adjacent to the B-nanolayers.

2. Coating system according to claim 1 characterized in that the coating system exhibits a thermal conductivity coefficient lower than 3.0 W/m·K.

3. Coating system according to claim 1 characterized in that the sum of the thickness of an A-nanolayer and the thickness of a B-nanolayer deposited one on each other in the multi-layered film is not greater than 200 nm.

4. Coating system according to claim 1 characterized in that the ratio of the thickness of a B-nanolayer to the thickness of an A-nanolayer deposited one on each other in the multi-layered film is not greater than 2.

5. Coating system according to claim 4 , wherein the ratio of the thickness of a B-nanolayer to the thickness of an A-nanolayer deposited one on each other in the multi-layered film is about 1.

6. Coating system according to claim 1 characterized in that the coating system comprises a base layer deposited between the substrate surface and the multi-layered film, preferably the element composition of the base layer is essentially defined by the formula (Al w Cr 1-w )N wherein:

w is the concentration of Al in atomic percent if only the elements Al and Cr are considered for the calculation, with

w=50-80 at %.

7. Coating system according to claim 6 characterized in that the coating system comprises a multilayer-structured film deposited on the base layer, wherein the multilayer-structured film is formed by C- and D-layers deposited alternate one on each other, wherein the C-layers are AlCrN-layers don't containing boron, and the D-layers are multi-layered films formed of alternated A- and B-nanolayers.

8. Coating system according to claim 1 characterized by having a constant ratio of aluminium content to chromium content at least along the thickness of the multi-layered film or at least if given along the thickness of the base layer.

9. Coated substrate with a coating system according to claim 1 characterized in that the substrate comprises a nitrogen-enriched diffusion zone at the interface with the coating system.

10. Coating system deposited on a surface of a substrate comprising at least one multi-layered film formed of alternated A- and B-nanolayers deposited one on each other, wherein the A-nanolayers consist of aluminium chromium boron nitride and the B-nanolayers contain aluminium chromium nitride but not contain boron characterized in that

the element composition of the A-nanolayers or if given in the region of the A-nanolayers having highest boron content is essentially defined by the formula (Al x Cr 1-x-z B z )N wherein:

x and z are respectively the concentration of Al and the concentration of B in atomic percent if only the elements Al, Cr and B are considered for the calculation, with

x=50-80 at-% and z=3-30 at-% and x+z≦90 at-%, and/or

the element composition of the B-nanolayers is essentially defined by the formula (Al y Cr 1-y )N wherein:

y is the concentration of Al in atomic percent if only the elements Al and Cr are considered for the calculation, with

y=50-80 at-%.

11. Coating system according to claim 10 wherein x=50-70 at-% and z=10-20 at-% and x+z≦80 at-% and y=60-70 at-%.

12. Coating system deposited on a surface of a substrate comprising at least one multi-layered film formed of alternated A- and B-nanolayers deposited one on each other, wherein the A-nanolayers consist of aluminium chromium boron nitride and the B-nanolayers contain aluminium chromium nitride but not contain boron, wherein the coating system comprises a base layer deposited between the substrate surface and the multi-layered film characterized in that the coating system comprises a multilayer-structured film deposited on the base layer, wherein the multilayer-structured film is formed by C- and D-layers deposited alternate one on each other, wherein the C-layers are AlCrN-layers don't containing boron, and the D-layers are multi-layered films formed of alternated A- and B-nanolayers.

13. Method for coating a surface of a substrate with a coating system according to claim 1 characterized in that at least the multi-layered film is deposited by means of physical vapour deposition techniques of at least one target containing aluminium chromium and boron for forming the A-nanolayers and at least one target containing aluminium and chromium for producing the B-nanolayers in a nitrogen containing atmosphere, and at least by depositing the B-containing layers a negative bias voltage at the substrate is applied.

14. Method according to claim 13 characterized in that the target for forming the A-nanolayers has an element composition in atomic percentage given by the formula (Al i Cr 1-i ) 1-j B j and the at least one target for forming the B-nanolayers has an element composition in atomic percentage given by the formula (Al i Cr 1-i ), where:

i is preferably not lower than 50 at.-% and not greater than 80 at.-%,

j is preferably not lower than 2 at.-% and not greater than 30 at.-%.

15. Method according to claim 14 , wherein i is 70 at.-%.

16. Method according to claim 13 for coating a surface of a substrate with a coating system comprising at least one multi-layered film formed of alternated A- and B-nanolayers deposited one on each other, wherein the A-nanolayers consist of aluminium chromium boron nitride and the B-nanolayers contain aluminium chromium nitride but not contain boron, wherein the A-nanolayers have a region with highest boron content and a region with lower boron content, wherein the region having lower boron content is the region which is adjacent to the B-nanolayers, and wherein a base layer deposited between the substrate surface and the multi-layered film

characterized in that the base layer is deposited by means of a physical vapour deposition technique.

17. Method according to claim 16 , wherein an element composition of the base layer is essentially defined by the formula (Al w Cr 1-w )N wherein:

w is the concentration of Al in atomic percent if only the elements Al and Cr are considered for the calculation, with w=50-80 at-%.

18. Method according to claim 16 , wherein the physical vapour deposition technique comprises a reactive cathodic arc ion plating techniques and applying a negative bias voltage at the substrate during at least a part of the deposition time.

19. Method according to claim 16 characterized in that a negative bias voltage applied during the deposition of the base layer is varied during deposition and increased from a lowest value U Bias _ lowest up to a highest value U Bias _ highest .

20. Method according to claim 19 wherein the lowest value U Bias _ lowest is not greater than 4 times the highest U Bias _ highest in absolute value.

21. Method according to claim 13 for producing a coated substrate comprising at least one multi-layered film formed of alternated A- and B-nanolayers deposited one on each other, wherein the A-nanolayers consist of aluminium chromium boron nitride and the B-nanolayers contain aluminium chromium nitride but not contain boron, wherein the A-nanolayers have a region with highest boron content and a region with lower boron content, wherein the region having lower boron content is the region which is adjacent to the B-nanolayers and wherein the substrate comprises a nitrogen-enriched diffusion zone at the interface with the coating system, characterized in that the diffusion zone is produced by accomplishing a plasma etching step prior to coating deposition which is carried out in a nitrogen, or in a nitrogen/hydrogen, or in a nitrogen/hydrogen/argon atmosphere.

22. Method according to claim 13 wherein the physical vapour deposition techniques comprise cathodic arc and/or magnetron sputtering techniques, in particular high power impulse magnetron sputtering techniques, material for forming the multi-layered film is provided by cathodic arc ion plating evaporation, wherein the target for forming the A-nanolayers comprises a powder metallurgy made target, and the target for forming the B-nanolayers comprises a powder metallurgy made target, and wherein the negative bias voltage is not lower than 70 V in absolute value.