METHODS AND COMPOSITIONS FOR INCREASING INK CLAY LOADING IN HEATSET INK FORMULATIONS WHILE MAINTAINING INK GLOSS, AND INK FORMULATIONS PRODUCED THEREFROM
A surface-modified hydrophobic clay composition for an ink formulation comprises up to 99 wt % clay particles with a particle-size distribution characterized in that at least 10% are smaller than 0.2 microns, at least 25% are smaller than 0.5 microns, and at least 95% are less than 5 microns; and from about 1 wt % to about 10 wt % of one or more organic compounds selected from quaternary ammonium compounds, organic acids, fatty acids, organic silanes, or organic polysilanes. The surface-modified hydro-phobic day composition may be produced by various methods, including a slurry method or a dry-mixing method. Ink clay loadings in heatset ink formulations may be increased to 10-15% without losing ink gloss. Inks may be produced with lower solvent, resin, and/or pigment concentrations, thereby reducing cost.
1 - 84 . (canceled)
85 . A surface-modified hydrophobic clay composition for an ink formulation, said composition comprising:
(i) up to 99 wt % clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and
(ii) from about 1 wt % to about 5 wt % of one or more quaternary ammonium compounds given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4 are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion.
86 . (canceled)
87 . The composition of claim 85 , wherein at least 50% of said clay particles are smaller than 0.2 microns.
88 - 91 . (canceled)
92 . The composition of claim 85 , wherein said clay particles comprising one or more clays selected from the Kaolin group of minerals comprising kaolinite, dickite, halloysite, nacrite, montmorrilite, or any other polymorph of Al 2 Si 2 O 5 (OH) 4 .
93 . The composition of claim 92 , wherein said clay particles are kaolin clay particles.
94 . The composition of claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is selected from C 10 -C 24 chains.
95 . The composition of claim 94 , wherein at least two of R 1 , R 2 , R 3 , and R 4 are selected from C 10 -C 24 chains.
96 . The composition of claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is selected from C 1 -C 9 chains.
97 . The composition of claim 96 , wherein at least two of R 1 , R 2 , R 3 , and R 4 are selected from C 1 -C 9 chains.
98 . The composition of claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is a methyl group.
99 . The composition of claim 98 , wherein at least two of R 1 , R 2 , R 3 , and R 4 are methyl groups.
100 . The composition of claim 85 , wherein two of R 1 , R 2 , R 3 , and R 4 are methyl groups and wherein the other two of R 1 , R 2 , R 3 , and R 4 are selected from C 16 -C 18 chains.
101 . The composition of claim 85 , wherein X is an organic anion.
102 . The composition of claim 85 , wherein X is an inorganic anion.
103 . The composition of claim 102 , wherein X is a halide anion.
104 . (canceled)
105 . A surface-modified hydrophobic clay composition for an ink formulation, said composition comprising:
(i) up to 99 wt % clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and
(ii) from about 1 wt % to about 10 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.
106 . The composition of claim 105 , comprising from about 2 wt % to about 8 wt % of said one or more organic compounds.
107 . (canceled)
108 . The composition of claim 105 , wherein at least 50% of said clay particles are smaller than 0.2 microns.
109 - 112 . (canceled)
113 . The composition of claim 105 , wherein said clay particles comprising one or more clays selected from the Kaolin group of minerals comprising kaolinite, dickite, halloysite, nacrite, montmorrilite, or any other polymorph of Al 2 Si 2 O 5 (OH) 4 .
114 . The composition of claim 113 , wherein said clay particles are kaolin clay particles.
115 . A heatset ink formulation comprising:
(i) a solvent;
(ii) a pigment or dye;
(iii) a resin;
(iv) clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and
(v) from about 1 wt % to about 5 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.
116 . The heatset ink formulation of claim 115 , wherein said organic compound is a quaternary ammonium compound given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4 are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion.
117 . The heatset ink formulation of claim 116 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is selected from C 10 -C 24 chains.
118 . The heatset ink formulation of claim 115 , wherein said organic compound is an organic acid.
119 . The heatset ink formulation of claim 118 , wherein said organic compound is a saturated or unsaturated fatty acid having at least four carbon atoms.
120 . The heatset ink formulation of claim 119 , wherein said fatty acid is stearic acid.
121 . The heatset ink formulation of claim 115 , wherein said organic compound is an organic silane.
122 . The heatset ink formulation of claim 121 , wherein said organic compound is an organic polysilane.
123 . The heatset ink formulation of claim 115 , wherein said resin is present at about 35 wt % or less in said heatset ink formulation.
124 - 125 . (canceled)
126 . The heatset ink formulation of claim 115 , wherein said clay particles are present at about 5 wt % or more in said heatset ink formulation.
127 - 128 . (canceled)
129 . A UV-curable ink formulation comprising:
(i) a solvent;
(ii) a pigment or dye;
(iii) a resin;
(iv) clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and
(v) from about 1 wt % to about 5 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.
130 . The UV-curable ink formulation of claim 129 , wherein said organic compound is a quaternary ammonium compound given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4 are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion.
131 . The UV-curable ink formulation of claim 130 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is selected from C 10 -C 24 chains.
132 . The UV-curable ink formulation of claim 129 , wherein said organic compound is an organic acid.
133 . The UV-curable ink formulation of claim 132 , wherein said organic acid is a saturated or unsaturated fatty acid having at least four carbon atoms.
134 . The UV-curable ink formulation of claim 133 , wherein said fatty acid is stearic acid.
135 . The UV-curable ink formulation of claim 129 , wherein said organic compound is an organic silane.
136 . The UV-curable ink formulation of claim 135 , wherein said organic compound is an organic polysilane.