Sealing material for light emitting device, light emitting device using the same, and manufacturing method for light emitting device
The present invention is intended to provide a sealing material for a light emitting device, which is able achieve both the adhesiveness and the crack resistance, have the high sulfurization resistance and the wet heat resistance, and seal the light emitting element. The sealing material for a light emitting device for sealing a light emitting element is characterized in that in a solid Si-nuclear magnetic resonance spectrum, a peak has a peak top in a chemical shift within a range of −120 ppm or more and −90 ppm or less, and a half width of 5 ppm or more and 12 ppm or less; in the solid Si-nuclear magnetic resonance spectrum, a peak has a peak top in a chemical shift within a range of −80 ppm or more and −40 ppm or less, and a half width of 5 ppm or more and 12 ppm or less; and a silanol content ratio is 11% by weight or more and 30% by weight or less.
1. A sealing material for a light emitting device for sealing a light emitting element, wherein:
in a solid Si-nuclear magnetic resonance spectrum, a peak has a peak top in a chemical shift within a range of −120 ppm or more and −90 ppm or less, and a half width of 5 ppm or more and 12 ppm or less;
in the solid Si-nuclear magnetic resonance spectrum, a peak has a peak top in a chemical shift within a range of −80 ppm or more and −40 ppm or less, and a half width of 5 ppm or more and 12 ppm or less; and
a silanol content ratio is 11% by weight or more and 30% by weight or less.
2. The sealing material for the light emitting device according to claim 1 , containing inorganic oxide fine particles.
3. The sealing material for the light emitting device according to claim 2 , wherein the inorganic oxide fine particles are ZrO 2 .
4. The sealing material for the light emitting device according to claim 1 , containing a cyclic ether compound.
5. The sealing material for the light emitting device according to claim 1 , containing a silane coupling agent.
6. The sealing material for the light emitting device according to claim 1 , containing phosphor particles.
7. A light emitting device in which at least a light emitting surface of an light emitting element is covered with a sealing layer, wherein
the sealing layer having a film thickness of 10 μm or more and less than 500 μm is formed with the sealing material for the light emitting device according to claim 1 .
8. A light emitting device, in which at least a light emitting surface of a light emitting element is covered with a sealing layer, comprising a phosphor-containing resin layer containing a resin and phosphor particles on the sealing layer, wherein
the sealing layer is formed with the sealing material for the light emitting device according to claim 1 , and has a film thickness of 0.7 μm or more and 15 μm or less.
9. The light emitting device according to claim 7 , wherein the light emitting element is a light emitting diode.
10. A production method of a light emitting device in which at least a light emitting surface of a light emitting element is covered with a sealing layer, comprising the steps of:
applying a sealing agent for the light emitting device onto the light emitting element; and
forming a sealing layer containing the sealing material for the light emitting element according to claim 1 by curing the sealing agent for the light emitting device at 80° C. or more.
11. The light emitting device according to claim 8 , wherein the light emitting element is a light emitting diode.