IP Library Granted Patent US 9,790,242
Granted Patent B2
US 9,790,242 · App. 14/406,679 · Granted Oct 17, 2017

Surface treatment method, surface treatment agent, and novel compound

Inventors: Kunio Mori (Morioka, JP); Yusuke Matsuno (Morioka, JP); Katsuhito Mori (Morioka, JP); Takahiro Kudo (Morioka, JP); Shuukichi Takii (Ayase, JP); Shigeru Michiwaki (Ayase, JP); Manabu Miyawaki (Ayase, JP); Masanori Yanai (Ayase, JP); Kouichi Kamiyama (Ayase, JP); Hitomi Chiba (Ayase, JP); Yasuyuki Masuda (Ayase, JP)
Assignees: Kunio Mori; Sulfur Chemical Laboratory, Inc.
C07F7/1836Y10T428/31678
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Quick Facts
Patent No.
US 9,790,242
App. No.
14/406,679
Granted
Oct 17, 2017
Kind
B2
Abstract

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: the compound (α) is at least one of Formula [IV] and Formula [V]: wherein A is —N(R a )R b —Si(R c ) n (OR d ) 3−n , or —N{R b —Si(R c ) n (OR d ) 3−n } 2 , B is ——N(R e )R f (NH 2 ) m , or —N{R f (NH 2 ( m } 2 , C is A, B, or —N(R g )R h , D is R i and wherein each of R a , R e , and R g is independently H or a hydrocarbon group, R b , R c , R d , R f , R h , and R i are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.

Claims (18)

1. A surface treatment method, comprising:

applying a compound α to a substrate;

wherein the compound α is at least one of Formula [IV] and Formula [V]:

wherein

A is —N(R a )R b —Si(R c ) n (OR d ) 3−n , or —N{R b —Si(R c ) n (OR d ) 3−n } 2

B is —NHNH 2 , —N(R e )R f (NH 2 ) m , or —N{R f (NH 4 ) m } 2

C is A, B, or —N(R g )R h

D is R i

wherein each of R a , R e and R g is independently H or a hydrocarbon group consisting of H and C atoms,

R b , R c , R d , R f , R h , and R i are hydrocarbon groups consisting of H and C atoms,

n is 0, 1, or 2, and

m is 1 or 2.

2. The surface treatment method according to claim 1 , wherein applying the compound α comprises coating a solution comprising the compound α onto the substrate.

3. The surface treatment method according to claim 1 , wherein applying the compound α comprises evaporation of the compound α.

4. The surface treatment method according to claim 1 , further comprising before application of the compound α, subjecting the substrate to at least one treatment selected from the group consisting of a cleaning treatment, a corona discharge treatment, a plasma discharge treatment, an ultraviolet ray irradiation, an acid treatment, an alkaline treatment, a steam treatment, and a chemical conversion coating.

5. The surface treatment method according to claim 1 , further comprising after application of the compound α, subjecting the substrate to a heating treatment.

6. The surface treatment method according to claim 1 , wherein bonding of the compound α to the substrate is obtained.

7. The surface treatment method according to claim 6 , wherein the bonding is obtained by chemical reaction of the compound α to the substrate and/or physical absorption of the compound α by the substrate.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Jan 31, 2022
From: MEIKO ELECTRONICS CO., LTD.
To: KUNIO MORI; SULFUR CHEMICAL LABORATORY INC.
Reel/Frame 058824/0332 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2014
From: MORI, KUNIO; MATSUNO, YUSUKE; MORI, KATSUHITO; KUDO, TAKAHIRO; TAKII, SHUUKICHI; MICHIWAKI, SHIGERU; MIYAWAKI, MANABU; YANAI, MASANORI; KAMIYAMA, KOUICHI; CHIBA, HITOMI; MASUDA, YASUYUKI
To: KUNIO MORI; SULFUR CHEMICAL LABORATORY, INC.; MEIKO ELECTRONICS CO., LTD.
Reel/Frame 034440/0909 →
Priority Claims (1)
JP 2012-132410 · Jun 11, 2012 · national
Continuity (1)
Related Publication 20150152124A1 · Jun 4, 2015