IP Library Granted Patent US 9,896,371
Granted Patent B2
US 9,896,371 · App. 14/407,921 · Granted Feb 20, 2018

Tempered glass cutting method and cutting apparatus

Inventors: Jaemin Cha (Asan-si, KR); Kiyeon Lee (Asan-si, KR); Youngseok Lee (Asan-si, KR); Ji Hoon Rhee (Asan-si, KR); Jaeho Lee (Asan-si, KR)
Assignee: Corning Precision Materials Co., Ltd.
C03B33/02B28D1/221C03B25/025C03B27/012C03B33/023C03B33/09C03B33/091C03B33/093C03C21/002C03C21/008Y02P40/57
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Quick Facts
Patent No.
US 9,896,371
App. No.
14/407,921
Granted
Feb 20, 2018
Kind
B2
Abstract

The present invention is devised to solve the problems of the above-described conventional technologies. The purpose of the present invention is to provide a tempered glass cutting method and cutting apparatus which can prevent the defects of the tempered glass breaking when same is cut and improve the reliability of the product. To this end, provided is a tempered glass cutting method which comprises: a tempering step of generating compressive stress on a glass sheet to temper the glass sheet; a compressive stress relaxation step of applying heat to the cut portion of the tempered glass sheet to relax the compressive stress; and a cutting step of cutting the cut portion.

Claims (11)

1. A method of cutting toughened glass comprising:

toughening a raw glass plate by generating compressive stress in a surface layer of the raw glass plate;

reducing the compressive stress in the surface layer at portions of the toughened raw glass plate to be cut by applying heat to the surface layer at the portions to be cut; and

cutting the toughened raw glass plate along the portions to be cut while applying heat to the surface layer at the portions to be cut so that the compressive stress in the surface layer at the portions to be cut remains reduced.

2. The method according to claim 1 , wherein the compressive stress in the surface layer at the portions to be cut is reduced by applying the heat to the surface layer at the portions to be cut with hot wires.

3. The method according to claim 1 , wherein the compressive stress in the surface layer at the portions to be cut is reduced to 100 MPa or less by the step of reducing the compressive stress.

4. The method according to claim 1 , wherein a width of each of the portions to be cut is 5 mm or less.

5. The method according to claim 1 , wherein the raw glass plate is toughened by chemical toughening or thermal toughening.

6. The method according to claim 5 , wherein the chemical toughening comprises coating a surface of the raw glass plate with an ion exchange solution in which a potassium nitrate solution and zinc oxide powder are mixed, followed by drying and subsequently heating a resultant structure.

7. The method according to claim 1 , wherein the toughened raw glass plate is cut along the portions to be cut using a laser or a scribing device.

8. The method according to claim 1 , wherein a temperature of the heat applied to the surface layer at the portions to be cut at the step of reducing the compressive stress is equal to or higher than a transition point and is lower than a melting point of the raw glass plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2014
From: CHA, JAEMIN; LEE, KIYEON; LEE, YOUNGSEOK; RHEE, JI HOON; LEE, JAEHO
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 034530/0186 →
Priority Claims (1)
KR 10-2012-0062779 · Jun 12, 2012 · national
Continuity (1)
Related Publication 20150166390A1 · Jun 18, 2015