Copolymer, monomer composition, resin solution, and resin film
View Patent ↗A copolymer of the present invention comprises a repeating unit derived from phenylphenyl (meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.
1. A copolymer, comprising:
a repeating unit derived from phenylphenyl (meth)acrylate;
a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and
a repeating unit derived from an epoxy group-containing unsaturated compound.
2. A copolymer according to claim 1 , wherein the copolymer comprises 5 mol % to 70 mol % of the repeating unit derived from the phenylphenyl (meth)acrylate, 5 mol % to 80 mol % of the repeating unit derived from the hydroxyphenyl group-containing unsaturated compound, and 5 mol % to 60 mol % of the repeating unit derived from the epoxy group-containing unsaturated compound.
3. A copolymer according to claim 1 , wherein the hydroxyphenyl group-containing unsaturated compound is hydroxyphenyl (meth)acrylate.
4. A copolymer according to claim 1 , wherein the epoxy group-containing unsaturated compound is an epoxy group-containing (meth)acrylate.
5. A copolymer according to claim 4 , wherein the epoxy group-containing (meth)acrylate is selected from the group consisting of glycidyl methacrylate and 3,4-epoxycyclohexylmethyl methacrylate.
6. A monomer composition, comprising:
1 mass % to 45 mass % of phenylphenyl (meth)acrylate;
1 mass % to 43 mass % of a hydroxyphenyl group-containing unsaturated compound;
1 mass % to 40 mass % of an epoxy group-containing unsaturated compound;
45 mass % to 90 mass % of a reaction solvent; and
0.2 mass % to 20 mass % of a polymerization initiator.
7. A monomer composition according to claim 6 , wherein the hydroxyphenyl group-containing unsaturated compound is hydroxyphenyl (meth)acrylate.
8. A monomer composition according to claim 6 , wherein the epoxy group-containing unsaturated compound is an epoxy group-containing (meth)acrylate.
9. A monomer composition according to claim 8 , wherein the epoxy group-containing (meth)acrylate is selected from the group consisting of glycidyl methacrylate and 3,4-epoxycyclohexylmethyl methacrylate.
10. A copolymer, which is obtained by polymerizing the monomer composition according to claim 6 .
11. A resin solution, comprising the copolymer according to claim 1 .
12. A resin solution, which is obtained by:
polymerizing the monomer composition according to claim 6 at 70 to 100° C. for 5 to 10 hours; and
adjusting a solid content to 20 to 50 mass %.
13. A resin film, which is obtained by:
applying the resin solution according to claim 11 onto a substrate; and
drying the resin solution.
14. A resin solution, comprising the copolymer according to claim 10 .