Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structure
The present invention is to provide an anisotropic conductive film that excels in dispersing conductive particles and trapping the particles, and maintains conduction reliability even between narrow-pitched terminals. By a method for manufacturing an anisotropic conductive film containing conductive particles, the conductive particles are buried in grooves in a sheet having the grooves regularly formed in the same direction, the conductive particles are arranged, a first resin film having a thermo-setting resin layer formed on a stretchable base film is laminated on the surface of the sheet on the side of the grooves to transfer and attach the conductive particles to the first resin film, the first resin film is uniaxially stretched in a direction other than the direction perpendicular to the array direction of the conductive particles, and a second resin film is laminated.
1. An anisotropic conductive film comprising:
a resin layer; and
a plurality of conductive particles in contact with the resin layer,
wherein the conductive particles form a particle row in which particle intervals are arranged with a predetermined regularity in a first direction on the resin layer,
wherein a plurality of the particle rows are arranged in a second direction orthogonal to the first direction,
wherein the conductive particles in each particle row are arranged randomly within the particle row in the second direction, and
wherein each conductive particle in each particle row varies in the second direction relative to other conductive particles in the particle row.
2. A connected structure comprising the anisotropic conductive film according to claim 1 connected to an electronic component.
3. The anisotropic conductive film according to claim 1 ,
wherein the resin layer is formed with at least two layer structures, comprising at least a first resin layer forming a layer, and a second resin layer laminated on the first resin layer, and
wherein the conductive particles are in contact with at least the first resin layer.
4. The anisotropic conductive film according to claim 1 , wherein a width of the particle rows in the second direction is greater than 1 and less than 2.5 times a particle size of the conductive particles.
5. The anisotropic conductive film according to claim 1 , wherein a width of the particle rows in the second direction is greater than 1 and less than 2.5 times a particle size of the conductive particles and is defined by two edges, and an edge portion of each conductive particle in at least one particle row is in contact with either of the two edges.
6. The anisotropic conductive film according to claim 1 , wherein a distance between conductive particles in the particle rows in the first direction is equal.
7. The anisotropic conductive film according to claim 1 , wherein the second direction is oblique to the longitudinal direction of the film.
8. A method for manufacturing a connected structure including the anisotropic conductive film according to claim 1 , the method comprising:
connecting an electronic component to the connected structure using the anisotropic film.
9. A connection structure comprising:
a plurality of electronic components; and
an anisotropic conductive film connecting the plurality of electronic components together, the anisotropic conductive film comprising:
a resin layer; and
a plurality of conductive particles in contact with the resin layer,
wherein the conductive particles form a particle row in which particle intervals are arranged with a predetermined regularity in a first direction on the resin layer,
wherein a plurality of the particle rows are arranged in a second direction orthogonal to the first direction,
wherein the conductive particles in each particle row are arranged randomly within the particle row in the second direction, and
wherein each conductive particle in each particle row varies in the second direction relative to other conductive particles in the particle row.
10. The connection structure according to claim 9 , wherein
the resin layer has at least two-layer structure including a first resin layer constituting one layer, and a second resin layer laminated on the first resin layer, and
the conductive particles are in contact with at least the first resin layer.
11. A method for manufacturing connecting structure comprising
a step of connecting electronic components to each other via an anisotropic conductive film,
the anisotropic conductive film comprising:
a resin layer; and
a plurality of conductive particles in contact with the resin layer,
wherein the conductive particles form a particle row in which particle intervals are arranged with a predetermined regularity in a first direction on the resin layer,
wherein a plurality of the particle rows are arranged in a second direction orthogonal to the first direction,
wherein the conductive particles in each particle row are arranged randomly within the particle row in the second direction, and
wherein each conductive particle in each particle row varies in the second direction relative to other conductive particles in the particle row.
12. The method for of manufacturing a connection structure according to claim 11 , wherein
the resin layer has at least two-layer structure including a first resin layer constituting one layer, and a second resin layer laminated on the first resin layer, and
the conductive particles are in contact with at least the first resin layer.