THERMAL INTERPOSER SUITABLE FOR ELECTRONIC MODULES
A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force.
1 . A thermal interposer for providing a thermal interface between a surface of an electronic module and a heat sink, the thermal interposer comprising:
a body portion, the body portion having opposing first and second sides, the first and second sides configured to respectively contact the electronic module surface and the heat sink, the body portion including a plurality of cantilevered contact arms formed therein, each contact arm including a base portion attached to the body portion and a free end opposite the base portion, the contact arm being bent outwardly away from the first side at an angle thereto, the free end terminating in a contact face for contacting the electronic module surface when installed; and
the body portion further including a plurality of attachment members disposed along the second side thereof, each attachment member extending upward and away from the second side, each attachment member having a base portion and an attachment point opposite the base portion, each attachment member being received within corresponding opposing grooves of the heat sink in a manner wherein the attachment members intimately contact the grooves.
2 . The thermal interposer of claim 1 , wherein the attachment members include pegs with pointed ends.
3 . The thermal interposer of claim 1 , wherein the contact arms are arranged in rows upon the body portion, and the attachment members are arranged around a perimeter of the body portion.
4 . The thermal interposer of claim 3 , wherein the attachment members are further disposed on the body portion to surround each row of contact arms.
5 . The thermal interposer of claim 3 , wherein the attachment members are arranged in rows disposed between adjacent rows of contact arms.
6 . The thermal interposer of claim 5 , wherein pairs of attachment members in different rows are aligned with each other such that an imaginary line drawn through one of the pairs separates adjacent contact arms from each other.
7 . The thermal interposer of claim 1 , wherein the attachment members are arranged in a pattern on the body portion to divide the contact arms into distinct rows of contact arms.
8 . The thermal interposer of claim 1 , wherein some of the attachment members are disposed on the body portion proximate the contact arms base portions such that each contact arm base portion has at least one attachment member associated therewith to define a thermal transfer path between the attachment member and the contact arm.
9 . The thermal interposer of claim 1 , wherein the attachment members have a thickness equal to or greater than a width of the heat sink grooves.
10 . The thermal interposer of claim 1 , wherein the contact arms and the attachment members are aligned lengthwise with respect to the body portion.
11 . The thermal interposer of claim 1 , wherein the attachment members are arranged in distinct first and second groups, the attachment members of the first group being disposed along a portion of the perimeter of the interposer, and the attachment members of the second group being disposed interior of the interposer perimeter and aligned lengthwise with respect to the body portion.
12 . The thermal interposer of claim 11 , wherein some of the contact arm base portions and the attachment member base portions are disposed perpendicular to each other.
13 . The thermal interposer of claim 11 , wherein the body portion further includes a plurality of U-shaped openings, each opening being associated with and disposed proximate a respective one of the second group attachment members.
14 . An interposer for providing a thermal interface between a surface of an electronic module and a heat sink, the interposer comprising:
a body portion, the body portion including a plurality of sides cooperatively defining a perimeter thereof, first and second surfaces extending between opposing sides for respectively contacting an electronic module surface and a heat sink when the interposer is disposed between the electronic module and heat sink, and a plurality of cantilevered contact arms disposed thereon, each contact arm including a base portion attached to the body portion and a free end disposed opposite the base portion, each contact arm being bent away at an angle from the body portion first surface, each contact arm free end terminating in a contact face for contacting the electronic module surface; and
a plurality of attachment members formed as part of the body portion and disposed on the body portion second surface, each attachment member extending away from the body portion second surface in a direction opposite that of the contact arms, and having a base portion at one end joining with the body portion and an attachment point at an opposite end of the attachment member, some of the attachment members being disposed around the perimeter of the interposer body portion and others of the attachment members being disposed on the interposer body portion interior of the interposer body portion perimeter;
wherein the contact arm base portions and the attachment member base portions are arranged perpendicular to each other to define a plurality of heat transfer paths between the attachment members and the contact arms.
15 . The interposer of claim 14 , wherein some of the heat transfer paths are L-shaped.
16 . The interposer of claim 14 , wherein the attachment members are configured to be received within corresponding opposing grooves of the heat sink in a manner wherein the attachment members intimately contact the heat sink grooves.
17 . The interposer of claim 14 , wherein the attachment members are arranged in distinct first and second groups, the attachment members of the first group being disposed along a portion of the perimeter of the interposer, and the attachment members of the second group being disposed interior of the interposer perimeter and aligned lengthwise with respect to the body portion.
18 . The interposer as set forth in claim 14 , wherein the attachment members are arranged in a pattern on the body portion to divide the contact arms into distinct rows of contact arms.
19 . The interposer as set forth in claim 14 , wherein pairs of attachment members in different rows are aligned with each other such that an imaginary line drawn through one of the pairs separates adjacent contact arms from each other.
20 . The interposer as set forth in claim 14 , further including a heat sink, the heat sink including a plurality of grooves formed therein, the interposer attachment members being aligned with and received within the grooves.