Micro-channel heat sink for LED headlamp
The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate.
1. A heat sink for a semiconductor device, the heat sink comprising:
a base plate including a first side and a second side;
a back plate disposed adjacent the second side of the base plate;
a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate, wherein the back plate is disposed adjacent the distal end of the leg;
a plurality of fins arranged in the distal end of the leg;
a plurality of micro-channels defined by the plurality of fins; and
wherein the back plate is directly fastened to the leg wherein a cross-sectional area of the back plate in a plane perpendicular to the extending direction of the leg is less than a cross-sectional area of the first side of the base plate in a plane perpendicular to the extending direction of the leg.
2. The heat sink of claim 1 , wherein the surface area of the first side of the base plate is greater than the surface area of the distal end of the leg.
3. The heat sink of claim 1 , wherein the first side of the base plate further comprises a portion adapted to receive and make thermal contact with a semiconductor device.
4. The heat sink of claim 3 , wherein the base plate further comprises one or more flow channels formed in the first side allowing a fluid to be in thermal communication with the portion.
5. The heat sink of claim 1 , wherein the semiconductor device is a light-emitting diode.
6. The heat sink of claim 1 , wherein the leg is integral with the base plate, and the plurality of fins is integral with the leg, wherein one or more ribs having at least one plate mounting hole defined therein extend from the distal end of the leg, and wherein the back plate is directly fastened to the one or more ribs at the at least one plate mounting hole.
7. The heat sink of claim 1 , wherein the base plate and the leg are formed of a thermally conductive material.
8. The heat sink of claim 1 , the heat sink further comprising:
opposing walls extending between the distal end of the leg and the back plate; and
one or more headers formed between each of the opposing walls at or near the distal end, each header in fluid communication with the plurality of micro-channels.
9. The heat sink of claim 1 , wherein each micro-channel has a width between about 10 and about 500 microns.
10. The heat sink of claim 9 , wherein each micro-channel has a width of approximately 400 microns.
11. The heat sink of claim 1 , wherein each micro-channel has a depth between about 500 and about 5,000 microns.
12. The heat sink of claim 11 , wherein each micro-channel has a depth of approximately 2,000 microns.
13. The heat sink of claim 1 , wherein the leg has a length from the base plate to the distal end of between about 30 and about 45 millimeters.
14. The heat sink of claim 13 , wherein the leg has a length from the base plate to the distal end of approximately 38 millimeters.
15. The heat sink of claim 1 , wherein the surface area of the first side of the base plate is about 3,000 square millimeters, and the thickness of the base plate from the first side to the second side is about 10 millimeters.
16. A lamp for a vehicle, the lamp comprising:
a lens attached to a housing, the lens and the housing defining a volume;
a heat sink at least partially disposed within the volume, the heat sink comprising:
a base plate including a first side and a second side;
a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate;
a leg plate disposed adjacent the distal end of the leg;
a plurality of fins arranged in the distal end of the leg and disposed between the base plate and the leg plate;
a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate; and
a light-emitting diode attached to and in thermal contact with the first side of the base plate,
wherein the plurality of micro-channels allow a fluid to be in thermal communication with the volume; and
wherein the leg plate is directly fastened to the leg wherein a cross-sectional area of the leg plate in a plane perpendicular to the extending direction of the leg is less than a cross-sectional area of the first side of the base plate in a plane perpendicular to the extending direction of the leg.
17. The heat sink of claim 16 , wherein the surface area of the first side of the base plate is greater than the surface area of the distal end of the leg.
18. The heat sink of claim 16 , wherein the base plate further comprises one or more flow channels formed in the first side in fluid communication with the plurality of micro-channels.
19. The heat sink of claim 16 , wherein the leg is integral with the base plate.
20. The heat sink of claim 16 , wherein the leg plate is formed of a thermally insulative material.
21. The heat sink of claim 16 , wherein the leg includes one or more headers at or near the distal end, each header in fluid communication with the plurality of micro-channels.
22. The heat sink of claim 16 , wherein each micro-channel has a width between about 10 and about 500 microns.
23. The heat sink of claim 16 , wherein each micro-channel has a depth between about 500 and about 5,000 microns.
24. The heat sink of claim 16 , wherein the leg has a length from the base plate to the distal end of between about 30 and about 45 millimeters.