IP Library Granted Patent US 11,059,253
Granted Patent B2
US 11,059,253 · App. 14/427,022 · Granted Jul 13, 2021

Method and system for cardboard pretreatment

Inventor: Michael Zimmer (Moshav Beit-Eliazari, IL)
Assignee: HIGHCON SYSTEMS LTD.
B31B50/25B23K26/38B23K26/407B23K26/60B26D3/085B26D9/00B31F1/08B23K2103/40B23K2103/50B26D5/005B26F1/00B31B50/006B31B50/14B31B50/252
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Quick Facts
Patent No.
US 11,059,253
App. No.
14/427,022
Granted
Jul 13, 2021
Kind
B2
Abstract

A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

Claims (9)

1. A cardboard pretreatment system comprising:

a creasing module for creating at least one crease on a cardboard, along at least one line; and a processing module for processing the cardboard along the at least one line; and

wherein, the processing module is a laser module configured to direct a laser beam toward the cardboard along the at least one line; and

wherein the creasing module is configured to create the at least one crease to reduce the thickness of the cardboard along said at least one line prior to exposure to the laser beam of the processing module.

2. The cardboard pretreatment system of claim 1 wherein the processing module comprises at least one module selected from the group consisting of: a cutting module, a scoring module, a perforating module, a partially cutting module, and a marking module.

3. The cardboard pretreatment system of claim 1 , further comprising a controller for controlling passage of an input cardboard through the creasing module where the at least one pre-process crease is applied to the cardboard, and through the processing module where a cut is applied using the laser beam along the at least one pre-process crease.

4. The cardboard pretreatment system of claim 1 , wherein the creasing module is also configured to create at least one crease on the cardboard, along which no further processing is required.

5. The cardboard pretreatment system of claim 1 , wherein the cardboard is corrugated cardboard and wherein the creasing module reduces a thickness of the cardboard along the at least one pre-processing crease.

6. The cardboard pretreatment system of claim 5 , wherein the processing module is a laser module having a depth of focus and wherein the thickness of the cardboard is reduced to a value smaller than the depth of focus.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jan 12, 2020
From: BANK LEUMI LE-ISRAEL B.M.
To: HIGHCON SYSTEMS LTD.
Reel/Frame 051567/0984 →
ADDENDUM TO IP SECURITY INTEREST; REEL/FRAME: 0442214/0294 Recorded Oct 24, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 044279/0943 →
SECURITY INTEREST Recorded Apr 9, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 042214/0294 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2015
From: ZIMMER, MICHAEL
To: HIGHCON SYSTEMS LTD.
Reel/Frame 035167/0365 →
Continuity (2)
Provisional Application 61703239 · Sep 19, 2012
Related Publication 20150231739A1 · Aug 20, 2015