Semiconductor device and an integrated circuit comprising an ESD protection device, ESD protection devices and a method of manufacturing the semiconductor device
View Patent ↗A semiconductor device is provided which comprises an ESD protection device. The structure of the semiconductor device comprises a p-doped isolated region in which a structure is manufactured which operates as a Silicon Controlled Rectifier which is coupled between an I/O pad and a reference voltage or ground voltage. The semiconductor device also comprises a pnp transistor which is coupled parallel to the Silicon Controlled Rectifier. The base of the transistor is coupled to the gate of the Silicon Controlled Rectifier. In an optional embodiment, the base and gate are also coupled to the I/O pad.
1. A first ESD protection circuit for protecting an integrated circuit against relatively high positive voltages received an I/O pad of the integrated circuit, the first ESD protection circuit comprising:
a first terminal configured to be coupled to the I/O pad of the integrated circuit;
a second terminal configured to be coupled to a reference voltage or to a ground voltage;
a first Silicon-controlled rectifier, the first Silicon-controlled rectifier coupled with an anode connected to the first terminal and connected with a cathode to the second terminal;
a first pnp transistor, the first pnp transistor coupled with an emitter to the first terminal, coupled with a collector to the cathode, and connected with a base connected to a gate of the first Silicon-controlled rectifier.
2. A first ESD protection circuit according to claim 1 , wherein the base and the emitter of the first pnp transistor are connected together.
3. A first ESD protection circuit according to claim 1 further comprising:
a second Silicon-controlled rectifier, the second Silicon-controlled rectifier arranged in between the first Silicon-controlled rectifier and the second terminal, an anode of the second Silicon-controlled rectifier connected to the cathode of the first Silicon-controlled rectifier, a cathode of the second Silicon-controlled rectifier being connected to the second terminal.
4. An integrated circuit comprising the first ESD protection circuit of claim 1 , and further comprising a second ESD protection circuit for protecting an integrated circuit against relatively large negative voltages received an I/O pad of the integrated circuit, the second ESD protection circuit comprising:
a third terminal configured to be coupled to the I/O pad of the integrated circuit;
a fourth terminal configured to be coupled to a substrate voltage or to a ground voltage;
a further terminal configured to be coupled to a reference voltage or to the ground voltage;
a third Silicon-controlled rectifier, the third Silicon-controlled rectifier coupled with a cathode to the third terminal and coupled with an anode to the fourth terminal, the third Silicon-controlled rectifier formed by a third transistor and a fourth pnp transistor, the fourth pnp transistor coupled with an emitter to the anode of the third Silicon-controlled rectifier and with a collector to a gate of the third Silicon-controlled rectifier;
a second pnp transistor, the second pnp transistor coupled with a collector to a gate of the third Silicon-controlled rectifier, coupled with an emitter to the further terminal, and coupled with a base to the a base of the fourth pnp transistor.
5. A second ESD protection circuit according to claim 4 , wherein the base of the second pnp transistor is also coupled to the third terminal.
6. An integrated circuit comprising at least one of the first ESD protection circuit according to claim 1 .
7. An integrated circuit comprising a first ESD protection circuit for protecting an integrated circuit against relatively high positive voltages received an I/O pad of the integrated circuit, and a second ESD protection circuit for protecting an integrated circuit against relatively large negative voltages received an I/O pad of the integrated circuit;
the first ESD protection circuitry including
a first terminal configured to be coupled to the I/O pad of the integrated circuit;
a second terminal configured to be coupled to a reference voltage or to a ground voltage;
a first Silicon-controlled rectifier, the first Silicon-controlled rectifier coupled with an anode to the first terminal and coupled with a cathode to the second terminal;
a first pnp transistor, the first pnp transistor coupled with an emitter to the first terminal, coupled with a collector to the second terminal, and coupled with a base to the a gate of the first Silicon-controlled rectifier;
the second ESD protection circuitry including
a third terminal configured to be coupled to the I/O pad of the integrated circuit;
a fourth terminal configured to be coupled to a substrate voltage or to a ground voltage;
a further terminal configured to be coupled to a reference voltage or to the ground voltage;
a third Silicon-controlled rectifier, the third Silicon-controlled rectifier coupled with a cathode to the third terminal and coupled with an anode to the fourth terminal, the third Silicon-controlled rectifier formed by a third transistor and a fourth pnp transistor, the fourth pnp transistor coupled with an emitter to the anode of the third Silicon-controlled rectifier and with a collector to a gate of the third Silicon-controlled rectifier;
a second pnp transistor, the second pnp transistor coupled with a collector to a gate of the third Silicon-controlled rectifier, coupled with an emitter to the further terminal, and coupled with a base to the a base of the fourth pnp transistor.
8. A second ESD protection circuit according to claim 7 , wherein the base of the second pnp transistor is also coupled to the third terminal.