ETHYLENEAMINE EPOXY HARDENER
A curable composition comprising a blend of: a) an epoxy resin; and b) a hardener comprising a polyfunctional amine is disclosed. The curable composition can be used in a variety of applications including, but not limited to coatings, civil engineering, flooring, composites, adhesives, and electrical laminates.
1 . A curable composition comprising a blend of:
a) an epoxy resin; and
b) a hardener comprising a polyfunctional amine having the formula
wherein each R, T, U, V, W, X, Y, and Z group is the same or different and is selected from hydrogen or a hydrocarbyl group; and the value of x is 0 to 10, with the proviso that if x is greater than 1, each T may be the same or different.
2 . A curable composition in accordance with claim 1 wherein said polyfunctional amine has the formula
wherein each R, T, U, V, W, X, Y, and Z group is the same or different and is selected from hydrogen or a hydrocarbyl group; and the value of x is 0 to 10, with the proviso that if x is greater than 1, each T may be the same or different.
3 . A curable composition in accordance with claim 1 wherein said polyfunctional amine is bis(2-(piperazin-1-yl)ethyl)amine.
4 . A curable composition in accordance with claim 1 further comprising a hardener other than said polyfunctional amine.
5 . A curable composition in accordance with claim 1 wherein the epoxy resin is selected from the group consisting of aromatic epoxy resins and aliphatic epoxy resins.
6 . A curable composition in accordance with claim 1 having an epoxy to amine hydrogen equivalent weight ratio is in the range of from 0.7 to 1.3.
7 . A curable composition in accordance with claim 1 further comprising a catalyst.
8 . A curable composition in accordance with claim 7 wherein the catalyst is present in an amount in the range of from 5 weight percent to 1 weight percent, based on the total weight of the composition.
9 . A process for preparing a curable composition comprising admixing a) an epoxy resin and b) hardener comprising the polyfunctional amine of claim 1 .
10 . A process for preparing a thermoset comprising curing the curable composition of claim 1 .
11 . A process in accordance with claim 10 , wherein said curing is carried out at a temperature in the range of from 0° C. to 200° C.
12 . An article prepared from the curable composition of claim 1 .
13 . An article in accordance with claim 12 , wherein the article is selected from the group consisting of a coating, a composite, an adhesive, and an electrical laminate.