Electrical contact including corrosion-resistant coating
In accordance with one embodiment, an electrical contact has a mating end and a mounting end. The electrical contact includes an electrically conductive base, and a multi-layered coating disposed on an outer surface of the base at the mating end. The multi-layered coating can include a metallic layer of a noble metal or alloy thereof, a layer of anti-tarnish material disposed on the metallic layer, and a lubricant layer disposed on the layer of anti-tarnish material, the lubricant effective to seal at least some wear regions created in the layer of anti-tarnish material due to micromotion of the mating end in use.
1. An apparatus comprising:
a power electrical contact having a mating end and a mounting end, the power electrical contact comprising:
an electrically conductive base; and
a multi-layered coating disposed on an outer surface of the electrically conductive base at the mating end, the multi-layered coating including:
a metallic layer comprising a metal selected from a first group consisting of gold, silver and an alloy thereof;
an electroplated material layer disposed on the metallic layer; and
a top layer disposed on the electroplated material layer comprising a material selected from a second group consisting of an olefin and a perfluorinated polyether.
2. The apparatus of claim 1 , wherein the electrically conductive base comprises a copper or a copper alloy.
3. The apparatus of claim 1 , wherein the electrically conductive base comprises a barrier layer, and the multi-layered coating is disposed on an outer surface of the barrier layer.
4. The apparatus of claim 3 , wherein the barrier layer comprises nickel or tin.
5. The apparatus of claim 3 , wherein the barrier layer has a thickness of about 1.3 micrometers.
6. The apparatus of claim 1 , wherein the metallic layer has a thickness from about 0.2 micrometers to about 5 micrometers.
7. The apparatus of claim 1 , wherein the electroplated material layer has a thickness from about 0.005 micrometers to about 2 micrometers.
8. The apparatus of claim 1 , wherein the top layer comprises poly alpha olefin.
9. The apparatus of claim 1 , wherein the top layer has a thickness from about 0.3 micrometers to about 10 micrometers.
10. The apparatus of claim 1 , further comprising a high hardness layer disposed between the metallic layer and the electrically conductive base, the high hardness layer having a hardness greater than that of the metallic layer.
11. The apparatus of claim 10 , wherein the high hardness layer comprises PdNi.
12. The apparatus of claim 1 , wherein the electroplated material layer disposed directly on the metallic layer.
13. An electrical contact having a mating end and a mounting end, the electrical contact comprising:
an electrically conductive base; and
a multi-layered coating disposed on an outer surface of the electrically conductive base at the mating end, the multi-layered coating including:
a metallic layer comprising a metal selected from a first group consisting of gold, silver and an alloy thereof;
an electroplated material layer disposed on the metallic layer; and
a top layer disposed on the electroplated material layer comprising a material selected from a second group consisting of an olefin and a perfluorinated polyether.
14. The apparatus of claim 13 , wherein the electrically conductive base comprises a copper or a copper alloy.
15. The apparatus of claim 13 , wherein the electrically conductive base comprises a barrier layer, and the multi-layered coating is disposed on an outer surface of the barrier layer.
16. The apparatus of claim 15 , wherein the barrier layer comprises nickel or tin.
17. The apparatus of claim 15 , wherein the barrier layer has a thickness of about 1.3 micrometers.
18. A method of fabricating a mating end of an electrical contact having an electrically conductive base, the method comprising the steps of:
applying a metallic layer comprising a metal selected from a first group consisting of gold, silver and an alloy thereof onto an outer surface of the electrically conductive base;
applying an electroplated material layer onto an outer surface of the metallic layer; and
applying a top layer comprising a material selected from a second group consisting of an olefin and a perfluorinated polyether onto an outer surface of the electroplated material layer.
19. The method of claim 18 , wherein applying the metallic layer comprises applying from about 0.2 micrometers to about 5 micrometers of the metal selected from a first group consisting of gold, silver and an alloy.
20. The method of claim 18 , wherein applying the electroplated material layer comprises electroplating from about 0.005 micrometers to about 2 micrometers of a conductive material.