IP Library Granted Patent US 10,624,419
Granted Patent B2
US 10,624,419 · App. 14/445,752 · Granted Apr 21, 2020

Differing void cell matrices

Inventors: Jerod Dahl (Centennial, CO); Peter Foley (Castle Rock, CO); Collin Metzer (Highlands Ranch, CO); Trevor Kanous (Denver, CO); Eric William Sugano (Denver, CO)
Assignee: SKYDEX TECHNOLOGIES, INC.
A43B13/181A43B13/186A43B13/189A43B13/20
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Quick Facts
Patent No.
US 10,624,419
App. No.
14/445,752
Granted
Apr 21, 2020
Kind
B2
Abstract

A shoe sole comprises a first array of interconnected void cells that is oriented adjacent to a second opposing array of interconnected void cells, wherein the second opposing array of interconnected void cells is geometrically different from the first array of void cells and includes at least one void cell with an asymmetrical perimeter.

Claims (23)

1. A void cell arrangement comprising:

a first void cell matrix including a first array of void cells interconnected by a first binding layer oriented adjacent to a second opposing void cell matrix including a second array of void cells interconnected by a second binding layer, wherein a volume between the first binding layer and the second binding layer is open to atmosphere outside of an outer perimeter dimension of the entire first array of interconnected void cells and an outer perimeter dimension of the entire second array of interconnected void cells, wherein the second array of interconnected void cells is geometrically different from the first array of interconnected void cells, wherein the outer perimeter dimension of the entire second array of interconnected void cells is different than the outer perimeter dimension of the entire first array of interconnected void cells with respect to a plane perpendicular to the vertical direction, and wherein at least one void cell has an asymmetrical perimeter.

2. The void cell arrangement of claim 1 , wherein the first array of interconnected void cells includes at least one void cell that is different from a corresponding void cell of the second opposing array of interconnected void cells.

3. The void cell arrangement of claim 1 , wherein a depth of a void cell of the first array of interconnected void cells is different from a depth of a corresponding void cell of the second opposing array of interconnected void cells.

4. The void cell arrangement of claim 1 , wherein at least one of the void cells of the first array of interconnected void cells has different dimensions than a corresponding void cell of the second opposing array of interconnected void cells.

5. The void cell arrangement of claim 1 , wherein the second opposing array of interconnected void cells includes at least one void cell that opposes multiple void cells of the first array of interconnected void cells.

6. The void cell arrangement of claim 1 , wherein the void cell arrangement includes offset cut lines.

7. The void cell arrangement of claim 1 , wherein a draft angle of at least one void cell is different from a draft angle of another void cell.

8. A method comprising:

orienting a first void cell matrix including a first array of void cells interconnected by a first binding layer adjacent to a second opposing void cell matrix including a second array of void cells interconnected by a second binding layer, wherein a volume between the first binding layer and the second binding layer is open to atmosphere outside of an outer perimeter dimension of the entire first array of interconnected void cells and an outer perimeter dimension of the entire second array of interconnected void cells, wherein the second array of interconnected void cells is geometrically different from the first array of interconnected void cells, wherein the outer perimeter dimension of the entire second array of interconnected void cells is different than the outer perimeter dimension of the entire first array of interconnected void cells, and wherein at least one void cell has an asymmetrical perimeter; and

attaching one or more peaks of the interconnected void cells of the first array to one or more corresponding peaks of the interconnected void cells of the second array.

9. The method of claim 8 , wherein the first array of interconnected void cells includes at least one void cell that is different from a corresponding void cell of the second opposing array of interconnected void cells.

10. The method of claim 8 , wherein at least one of the void cells of the first array of interconnected void cells has different dimensions than a corresponding void cell of the second opposing array of interconnected void cells.

11. The method of claim 8 , wherein the second opposing array of interconnected void cells includes at least one void cell that corresponds to multiple void cells of the first array of interconnected void cells.

12. The method of claim 8 , wherein a depth of a void cell of the first array of interconnected void cells is different from a depth of a corresponding void cell of the second opposing array of interconnected void cells.

13. The method of claim 8 , wherein a draft angle of at least one void cell is different from a draft angle of another void cell.

14. The void cell arrangement of claim 1 , wherein the void cells of the first array and the void cells of the second array are open to atmosphere.

15. The method of claim 8 , wherein the void cells of the first array and the void cells of the second array are open to atmosphere.

16. The void cell arrangement of claim 1 , wherein at least one of the void cells of the first array is offset relative to a corresponding void cell of the second array.

17. The void cell arrangement of claim 1 , further comprising at least one stiffening channel separating adjacent void cells in at least one of the first array of void cells and the second array of void cells.

18. The void cell arrangement of claim 1 , wherein the void cell arrangement is in a shoe sole.

19. The void cell arrangement of claim 1 , wherein the outer perimeter dimension of the entire second array of interconnected void cells is different than the outer perimeter dimension of the entire first array of interconnected void cells with respect to a plane perpendicular to the vertical direction.

20. The void cell arrangement of claim 1 , wherein at least one void cell has an asymmetrical perimeter with respect to a plane perpendicular to the vertical direction.

Assignments (2)
SECURITY INTEREST Recorded Jan 31, 2022
From: SKYDEX TECHNOLOGIES, INC.
To: MONTAGE CAPITAL II, L.P.
Reel/Frame 058830/0849 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2014
From: DAHL, JEROD; FOLEY, PETER; METZER, COLLIN; KANOUS, TREVOR; SUGANO, ERIC WILLIAM
To: SKYDEX TECHNOLOGIES, INC.
Reel/Frame 033413/0761 →
Continuity (2)
Provisional Application 61861514 · Aug 2, 2013
Related Publication 20150033577A1 · Feb 5, 2015