Locally heated multi-zone substrate support

1. An electrostatic chuck, comprising:

an insulating base;

a dielectric layer disposed on the insulating base, the dielectric layer having a substrate supporting surface;

an electrode assembly disposed between the insulating base and the substrate supporting surface; and

a plurality of heating elements coupled to the insulating base, wherein the plurality of heating elements are formed on a backside surface of the insulating base, and the heating elements are arranged in independently controllable groups of at least one or more heating elements to azimuthally control a temperature profile across a substrate surface.

2. The electrostatic chuck of claim 1 , wherein the plurality of heating elements are arranged in a grid-like configuration, a pixel-like configuration, a dot-like configuration, a polar array configuration, or a concentric configuration.

3. The electrostatic chuck of claim 1 , wherein the plurality of heating elements are in the form of discrete metal sections.

4. The electrostatic chuck of claim 1 , wherein the plurality of heating elements comprises resistive heating elements.

5. The electrostatic chuck of claim 1 , wherein the electrode assembly has at least two interleaving electrodes.

6. The electrostatic chuck of claim 5 , wherein the at least two interleaving electrodes comprises a first set of electrode fingers and a second set of electrode fingers, wherein the first set of electrode fingers generate charges with a polarity that is different from the second set of electrode fingers.

7. The electrostatic chuck of claim 1 , wherein the plurality of heating elements comprises about 40 to about 300 heating elements.

8. The electrostatic chuck of claim 1 , wherein the dielectric layer is fabricated from a glass material or a ceramic material selected from a group consisting of silicon carbide, aluminum nitride, aluminum oxide, yttrium containing materials, yttrium oxide (Y 2 O 3 ), yttrium-aluminum-garnet (YAG), titanium oxide (TiO), or titanium nitride (TiN).

9. An electrostatic chuck, comprising:

an insulating base having a first surface and a second surface opposing the first surface;

an electrode assembly formed on the first surface of the insulating base, the electrode assembly having a first electrode interleaved with a second electrode;

a plurality of heating elements formed between interleaved portions of the first and second electrodes, wherein the plurality of heating elements are formed on the second surface of the insulating base; and

an encapsulating member coupled to the electrode assembly.

10. The electrostatic chuck of claim 9 , wherein the plurality of heating elements are in the form of discrete sections.

11. The electrostatic chuck of claim 9 , wherein the plurality of heating elements comprises resistive heating elements.

12. The electrostatic chuck of claim 9 , wherein the encapsulating member is fabricated from a glass material or a ceramic material selected from a group consisting of silicon carbide, aluminum nitride, aluminum oxide, yttrium containing materials, yttrium oxide (Y 2 O 3 ), yttrium-aluminum-garnet (YAG), titanium oxide (TiO), or titanium nitride (TiN).

13. A method for fabricating an electrostatic chuck, comprising:

forming an electrode assembly on an insulating base, wherein the electrode assembly includes a first electrode interleaved with a second electrode;

forming a plurality of heating elements on a backside of the insulating base, wherein the heating elements azimuthally control a temperature profile across a substrate surface; and

forming an encapsulating member on the electrode assembly.

14. The method of claim 13 , further comprising:

bonding the insulating base to the encapsulating member to form an integral component.

15. The electrostatic chuck of claim 1 , wherein the plurality of heating elements comprises inductive heating elements.

16. The electrostatic chuck of claim 9 , wherein the plurality of heating elements comprises inductive heating elements.