Ceramic electronic component
A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.
1. A ceramic electronic component comprising:
an electronic component body including a bare ceramic body including two principal surfaces opposed to each other, two end surfaces opposed to each other, and two lateral surfaces opposed to each other, and outer electrodes arranged to cover the end surfaces of the bare ceramic body; and
first and second metal terminals connected to the outer electrodes by solder containing Sn as a main constituent; wherein
at least a Ni-plated film is provided on a surface layer portion of each of the outer electrodes;
at least a Ni-plated film is provided on a surface layer portion of each of the first and second metal terminals; and
an alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between an adjacent pair of the outer electrodes and the first and second metal terminals in a central region of each of the end surfaces.
2. The ceramic electronic component according to claim 1 , wherein
each of the outer electrodes includes an underlying layer and a plating layer provided on a surface of the underlying layer;
each of the first and second metal terminals includes a terminal body and a plating layer provided on a surface of the terminal body; and
a metal of a material used as the terminal body of each of the first and second metal terminals and a metal of the underlying layer of each outer electrode are not diffused into the alloy layer.
3. The ceramic electronic component according to claim 1 , wherein
each of the outer electrodes includes an underlying layer and at least two plating layers provided on a surface of the underlying layer;
each of the first and second metal terminals includes a terminal body and at least two plating layers provided on a surface of the terminal body; and
a metal of an upper plating layer in the plating layers of each of the first and second metal terminals, a metal of an upper plating layer in the plating layers of each outer electrode, and a metal of the solder are not diffused into a metal of the terminal body of a corresponding one of the first and second metal terminals.
4. The ceramic electronic component according to claim 1 , wherein the bare ceramic body is a multilayer body.
5. The ceramic electronic component according to claim 1 , wherein the bare ceramic body includes a plurality of ceramic layers and a plurality of inner electrodes each disposed between adjacent pairs of the plurality of ceramic layers.
6. The ceramic electronic component according to claim 1 , wherein the first and second metal terminals are each defined by a plate-shaped lead frame.
7. The ceramic electronic component according to claim 1 , wherein the first and second metal terminals are each provided in an L-shaped section.
8. The ceramic electronic component according to claim 1 , wherein each of the first and second metal terminals includes a terminal bonding portion, an extending portion configured to extend from the terminal bonding portion, and a mounting portion configured to extend from the extending portion.
9. The ceramic electronic component according to claim 8 , wherein the extending portion is configured to float the electronic component body from a mounting substrate on which the electronic component body is mounted.
10. The ceramic electronic component according to claim 8 , wherein the extending portion is a plate extending from the terminal bonding portion in a height direction of the electronic component body.
11. The ceramic electronic component according to claim 8 , wherein the extending portion and the terminal bonding portion are arranged in a coplanar relationship.
12. The ceramic electronic component according to claim 8 , wherein the mounting portion is bent to extend toward a center of the electronic component body.
13. The ceramic electronic component according to claim 8 , wherein the mounting portion is bent to extend from an end of the extending portion in a direction parallel or substantially parallel to one of the two principal surfaces.
14. The ceramic electronic component according to claim 8 , wherein a length of the mounting portion is greater than that of the outer electrodes.
15. The ceramic electronic component according to claim 8 , wherein a length of the mounting portion is greater than that of the extending portion.
16. The ceramic electronic component according to claim 1 , wherein each of the first and second metal terminals includes a terminal body and at least two plated films arranged over a surface of the terminal body.
17. The ceramic electronic component according to claim 8 , further comprising non-plated portions in which no plated films are present, are provided in peripheral portions of the extending portion and the mounting portion of the first and second metal terminals.
18. The ceramic electronic component according to claim 17 , wherein surfaces of terminal bodies of the first and second metal terminals are exposed at the non-plated portions.
19. The ceramic electronic component according to claim 1 , wherein the bare ceramic body is defined by one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic and a magnetic ceramic.
20. The ceramic electronic component according to claim 1 , wherein the ceramic electronic component is one of a capacitor, a piezoelectric component, a thermistor, and an inductor.