IP Library Granted Patent US 10,399,190
Granted Patent B2
US 10,399,190 · App. 14/455,580 · Granted Sep 3, 2019

Liquid-vapor phase change thermal interface material

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Quick Facts
Patent No.
US 10,399,190
App. No.
14/455,580
Granted
Sep 3, 2019
Kind
B2
Abstract

An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Claims (43)

1. An assembly comprising:

a heat dissipating device having a casing with a heat releasing surface at which heat produced within or adjacent to the heat dissipating device accumulates and is removed from the heat dissipating device, the heat dissipating device having a plurality of screw bolt holes;

a heatsink having a base panel with an exterior-facing heat absorbing surface that absorbs the heat impacting the surface, the heat absorbing surface fixed in place across from the heat releasing surface by a separation distance, the heatsink having offsetting screw holes for insertion of screw bolts extending from the screw bolt holes of the heat dissipating device when the heat dissipating device and heatsink are assembled together with nuts screwed onto the screw bolts, the heat sink installed on top of the heat releasing surface of the heat dissipating device, wherein the heatsink is a cold plate having a second surface with a plurality of fins opposed to the heat absorbing surface, the second surface and plurality of fins cooled via an active air supply providing convection cooling using air movement generated by a fan;

a gasket having a closed perimeter and which extends upwards across the separation distance to form a volumetric space between the heat releasing surface and the heat absorbing surface, the gasket being sealably attached to both the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity, wherein the gasket comprises a self-resealable material that enables use of a syringe to add and replenish a supply of a working fluid via physical injection of the working fluid; and

a groove created within at least one of the heat releasing surface or the heat absorbing surface, the groove having a perimeter shape that substantially mirrors a shape of the gasket, wherein one of a top and a bottom surface of the gasket proximate to the groove is inserted within the groove to provide a mechanical seal;

wherein the working fluid disposed within the sealed interstitial cavity and which has specific thermal properties that cause the working fluid to (i) absorb latent heat and evaporate from a liquid to a vapor when the liquid contacts the heat releasing surface during operation of the heat dissipating device, wherein the liquid evaporates to create bubbles of vapor particles that rises up through a liquid surface and become a part of the vapor within the sealed interstitial cavity, and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink, wherein the vapor condenses at the heat absorbing surface into liquid droplets that fall back into the liquid at a lower layer of the sealed interstitial cavity, and wherein the working fluid is replenished via use of the syringe having a needle that is inserted through the self-resealable material of the gasket into the sealed interstitial cavity, wherein the working fluid serves as a thermal interface material that is a working transport medium between the heat releasing surface and the heat absorbing surface, and wherein the sealed interstitial cavity is sealed and provides a partial vacuum such that the working fluid exhibits specific thermal properties of the working fluid when disposed in the partial vacuum.

2. The assembly of claim 1 , wherein the gasket is sealably affixed to at least one of the heat releasing surface and the heat absorbing surface and extends away from the at least one of the heat releasing surface or the heat absorbing surface to support direct insertion of the gasket into the groove when the the heat releasing surface and the heat absorbing surface are brought together.

3. The assembly of claim 1 , wherein the working fluid is water and water vapor.

4. The assembly of claim 1 , wherein the heat dissipating device comprises a central processing unit (CPU).

5. The assembly of claim 1 , wherein the needle of the syringe is inserted into the gasket, whereby the gasket is pierced by the needle, and the working fluid is then injected into the sealed interstitial cavity from the syringe until sufficient amounts of the liquid is inserted, as determined via empirical analysis using a volume of the sealed interstitial cavity as one variable and a rate of heat exchange as another variable.

6. The assembly of claim 1 , wherein during the replenishment of the working fluid, the needle creates a small bore in the gasket and the self-resealable material of the gasket at which the needle is inserted is pliable and seals back into place once the needle is removed.

7. The assembly of claim 1 , wherein the sealed interstitial cavity comprises a partial vacuum, which causes the working fluid to be at a saturation point and allows for easier boiling of the working fluid whenever the heat is produced at the heat releasing surface of the heat dissipating device, the heat being applied to the working fluid at the saturation point that causes the working fluid to undergo a liquid-to-gas phase change.

8. An information handling system having at least one component requiring active heat dissipation, the information handling system comprising:

a heat dissipating device having a casing with a heat releasing surface at which heat produced within or adjacent to the heat dissipating device accumulates and is removed from the heat dissipating device, the heat dissipating device having a plurality of screw bolt holes;

a heatsink having a base panel with an exterior-facing heat absorbing surface that absorbs heat impacting the surface, the heat absorbing surface fixed in place across from the heat releasing surface by a separation distance, the heatsink having offsetting screw holes for insertion of screw bolts extending from the screw bolt holes of the heat dissipating device when the components are assembled together with nuts screwed onto the screw bolts, the heatsink installed on top of the heat releasing surface of the heat dissipating device, wherein the heatsink is a cold plate having a second surface with a plurality of fins opposed to the heat absorbing surface, the second surface and plurality of fins cooled via an active air supply providing convection cooling using air movement generated by at least one air moving device;

a gasket having a closed perimeter and which extends upwards across the separation distance to form a volumetric space between the heat releasing surface and the heat absorbing surface, the gasket being sealably attached to both the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity, wherein the gasket comprises a self-resealable material that enables use of a syringe to add and replenish a supply of working fluid via physical injection of the working fluid;

a groove created within at least one of the heat releasing surface or the heat absorbing surface, the groove having a perimeter shape that substantially mirrors a shape of the gasket, wherein one of a top and a bottom surface of the gasket proximate to the groove is inserted within the groove to provide a mechanical seal; and

a working fluid disposed within the sealed interstitial cavity and which has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor when the liquid contacts the heat releasing surface during operation of the heat dissipating device, wherein the liquid evaporates to create bubbles of vapor particles that rises up through a liquid surface and become a part of gas within the sealed interstitial cavity, and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink, wherein the vapor condenses at the heat absorbing surface into liquid droplets that fall back into the liquid at a lower layer of the sealed interstitial cavity, and wherein the working fluid is replenished via use of the syringe having a needle that is inserted through the self-resealable material of the gasket into the sealed interstitial cavity, wherein the working fluid serves as a thermal interface material that is a working transport medium between the heat releasing surface and the heat absorbing surface, and wherein the sealed interstitial cavity is sealed and provides a partial vacuum such that the working fluid exhibits specific thermal properties of the working fluid when disposed in the partial vacuum.

9. The information handling system of claim 8 , wherein the gasket is sealably affixed to at least one of the heat releasing surface or the heat absorbing surface and extends away from the at least one of the heat releasing surface or the heat absorbing surface to support direct insertion of the gasket into the groove when the heat releasing surface and the heat absorbing surface are brought together.

10. The information handling system of claim 8 , wherein the working fluid is water and water vapor.

11. The information handling system of claim 8 , wherein the heat dissipating device comprises a central processing unit (CPU).

12. The information handling system of claim 8 , wherein: the information handling system further comprises the at least one air moving device that directs air over the second surface to create the convection cooling of the cold plate.

13. The information handling system of claim 8 , wherein the needle of the syringe is inserted into the gasket, whereby the gasket is pierced by the needle, and the working fluid is then injected into the sealed interstitial cavity from the syringe until sufficient amounts of the liquid is inserted, as determined via empirical analysis using a volume of the sealed interstitial cavity as one variable and a rate of heat exchange as another variable.

14. The information handling system of claim 8 , wherein during the replenishment of the working fluid, the needle creates a small bore in the gasket and the self-resealable material of the gasket at which the needle is inserted is pliable and seals back into place once the needle is removed.

15. The information handling system of claim 8 , wherein the working fluid is at a saturation point that causes the fluid to undergo the liquid-to-gas phase change whenever the heat is produced at the heat releasing surface of the heat dissipating device.

16. The information handling system of claim 8 , wherein the sealed interstitial cavity comprises a partial vacuum, that causes the working fluid to be at a saturation point and allows for easier boiling of the working fluid when the heat is applied.

17. A method for cooling a heat producing device, the method comprising:

providing a gasket component attached to a heat releasing surface of a heat dissipating device, the gasket component extending outwards away from the heat releasing surface and forming a closed inner perimeter space;

fixably attaching a heatsink to the heat dissipating device such that an exterior-facing heat absorbing surface of the heatsink sealably impacts against a top of an extended portion of the gasket component to create a sealed interstitial cavity within the closed inner perimeter space; and

injecting a working fluid into the sealed interstitial cavity, the working fluid having thermal properties that (i) causes liquid of the working fluid in contact with the heat releasing surface to undergo a liquid-to-vapor phase change when heat is being released from the heat releasing surface of the heat dissipating device and (ii) causes vapor of the working fluid in contact with the heat absorbing surface of the heatsink to release latent heat and undergo a vapor-to-liquid phase change when the vapor within the cavity comes into contact with the heat absorbing surface;

wherein the working fluid serves as a thermal interface material that is a working transport medium between the heat releasing surface and the heat absorbing surface, and wherein the sealed interstitial cavity is sealed and provides a partial vacuum such that the working fluid exhibits specific thermal properties of the working fluid when disposed in the partial vacuum;

wherein the vapor condenses at the heat absorbing surface into liquid droplets that fall back into the liquid at a lower layer of the sealed interstitial cavity;

wherein the working fluid is replenished via use of a syringe having a needle that is inserted through a self-resealable material of the gasket component into the sealed interstitial cavity;

wherein the heat dissipating device has a casing with the heat releasing surface at which the heat produced within or adjacent to the heat dissipating device accumulates and is removed from the heat dissipating device, the heat dissipating device having a plurality of screw bolt holes;

wherein the heatsink has a base panel with the exterior-facing heat absorbing surface that absorbs the heat impacting the heat absorbing surface, the heat absorbing surface fixed in place across from the heat releasing surface by a separation distance, the heatsink having offsetting screw holes for insertion of screw bolts extending from the screw bolt holes of the heat dissipating device when the heat dissipating device and heatsink are assembled together with nuts screwed onto the screw bolts, the heatsink installed on top of the heat releasing surface of the heat dissipating device,

wherein the heatsink is a cold plate having a second surface with a plurality of fins opposed to the heat absorbing surface, the second surface and plurality of fins cooled via an active air supply providing convection cooling using air movement generated by at least one air moving device;

wherein the gasket component has a closed perimeter shape and extends upwards across the separation distance to form the sealed interstitial cavity between the heat releasing surface and the heat absorbing surface;

wherein the gasket component comprises the self-resealable material that enables use of the syringe to add and replenish a supply of the working fluid via physical injection of the working fluid;

creating a groove within at least one of the heat releasing surface or the heat absorbing surface, the groove having a perimeter shape that substantially mirrors a shape of the gasket component; and

inserting one of a top and a bottom surface of the gasket component proximate to the groove into the groove to provide a mechanical seal.

18. The method of claim 17 , further comprising removing air from the sealed interstitial cavity to generate the partial vacuum within the sealed interstitial cavity, prior to injecting the working fluid into the sealed interstitial cavity, wherein the working fluid is injected at a saturation point.

19. The method of claim 17 , wherein providing the gasket component further comprises fabricating the gasket component on the heat releasing surface.

20. The method of claim 17 , wherein the creating the groove within the at least one of the heat releasing surface or the heat absorbing surface comprises forming the groove within the heat absorbing surface of the heatsink, the groove having specific dimensions and the closed perimeter shape substantially mirrors a perimeter shape and width of a top portion of the gasket component to enable a physical insertion of the top portion of the gasket component within the groove, sealing an interior volume of the gasket when the heatsink is attached to the heat dissipating device.

Assignments (19)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (051302/0528) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.); SECUREWORKS CORP.
Reel/Frame 060438/0593 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL USA L.P.; ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
RELEASE OF SECURITY INTEREST AT REEL 051449 FRAME 0728 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.; EMC CORPORATION
Reel/Frame 058002/0010 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Dec 31, 2019
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.; EMC CORPORATION
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 051449/0728 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 16, 2019
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 051302/0528 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 034590 FRAME 0731 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0070 →
RELEASE OF REEL 034591 FRAME 0391 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0719 →
RELEASE OF REEL 034590 FRAME 0696 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL PRODUCTS L.P.
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SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 034590/0696 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 034591/0391 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034590/0731 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2014
From: SHELNUTT, AUSTIN MICHAEL; HELBERG, CHRISTOPHER M.; NORTH, TRAVIS C.; SALAS, RENE JASON
To: DELL PRODUCTS, L.P.
Reel/Frame 033498/0550 →
Cited By (5)
US 12,309,965 US 12,363,865 US 12,516,752 US 12,557,241 US 12,563,696