Granted Patent B2

US 12,563,696 · App. 18/373,539 · Granted Feb 24, 2026

Inventors: Ali Chehade (Moncheaux, FR); Gregory Francis Louis Bauchart (Wattrelos, FR)

Assignee: OVH

H05K7/20236H01L23/44G06F1/20H05K7/20272H05K7/20772H05K7/20781

Abstract

Claims (18)

1 . An immersive cooling system configured to cool at least one electronic device, the immersive cooling system comprising:

an immersive cooling container, including:

a first reservoir, configured to contain a dielectric immersion cooling liquid;

a second reservoir, configured to contain the dielectric immersion cooling liquid;

a plurality of slots, each slot in the plurality of slots configured to hold a casing;

a reservoir connector corresponding to each slot in the plurality of slots, the reservoir connector configured to provide fluid communication with the first reservoir; and

a pump configured to convey the dielectric immersion cooling liquid from the second reservoir to the first reservoir; and

a casing, configured to contain an electronic device to be cooled in an interior portion of the casing and configured to be disposed within a slot in the plurality of slots of the immersive cooling container, the casing including:

an inlet configured to be in fluid communication with the reservoir connector corresponding to the slot within which the casing is disposed to facilitate flow of the dielectric immersion cooling liquid into the interior portion of the casing through the reservoir connector, such that the dielectric immersion cooling liquid contacts the electronic device to collect thermal energy from the electronic device; and

an outlet configured to facilitate flow of the dielectric immersion cooling liquid from the interior portion of the casing into the second reservoir,

wherein the second reservoir comprises a sealing chamber, the sealing chamber comprising a plurality of openings aligned with the plurality of slots, each opening enabling insertion of a casing in a corresponding one of the slots, each opening being in a closed configuration by default to prevent the dielectric immersion cooling liquid from flowing from the second reservoir to a corresponding slot in absence of a casing in said slot.

2 . The immersive cooling system of claim 1 , wherein the inlet comprises a casing connector configured to fluidly couple with the reservoir connector corresponding to the slot within which the casing is disposed.

3 . The immersive cooling system of claim 2 , wherein a size of the casing connector is smaller than a size of the reservoir connector, such that the casing connector fits within the corresponding reservoir connector.

4 . The immersive cooling system of claim 2 , wherein a size of the casing connector is larger than a size of the reservoir connector, such that the reservoir connector fits within the corresponding casing connector.

5 . The immersive cooling system of claim 2 , wherein the casing connector is disposed on a bottom portion of the casing.

6 . The immersive cooling system of claim 1 , wherein the reservoir connector corresponding to an empty slot is closed using a self-closing mechanism.

7 . The immersive cooling system of claim 1 , wherein the first reservoir is disposed below the casing, such that the dielectric immersion cooling liquid from the first reservoir flows upwards into the interior portion of the casing.

8 . The immersive cooling system of claim 7 , wherein the outlet is disposed in an upper portion of the casing, and wherein the second reservoir is disposed at an upper portion of the casing, to receive a flow of the dielectric immersion cooling liquid from the outlet.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (316)