Granted Patent B2

US 10,020,242 · App. 15/098,810 · Granted Jul 10, 2018

Inventors: Shin Katsumata (Rockford, IL); Charles Shepard (DeKalb, IL)

Assignee: Hamilton Sundstrand Corporation

H01L23/44H05K7/20327H01L23/473H05K1/0203H05K7/20236H05K7/20881

Abstract

Claims (31)

1. An electronics cooling arrangement, comprising:

a housing configured to contain a coolant;

a dielectric coolant sealed within the housing; and

an electronic device with a printed circuit board (PCB) having a chip package coupled thereto, the electronic device disposed within the housing and submerged within the coolant,

wherein the PCB defines an inlet,

wherein the chip package defines an outlet, wherein the PCB and the chip package define within their interiors a passageway fluidly coupling the inlet with the outlet to allow fluid flowing between the inlet and the outlet to cool the electronic device,

wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing, wherein the outlet opens directly to the interior of the housing.

2. The electronics cooling arrangement as recited in claim 1 , further including a pump in fluid communication with the passageway.

3. The electronics cooling arrangement as recited in claim 2 , wherein the pump is configured to urge fluid through the passageway.

4. The electronics cooling arrangement as recited in claim 2 , wherein the pump is contained within the housing.

5. The electronics cooling arrangement as recited in claim 2 , further including a control module operatively connected with the pump and configured to selectively operate the pump according to heat generated by the electronic device.

6. The electronics cooling arrangement as recited in claim 1 , wherein the electronic component being submerged within a liquid phase of the dielectric coolant.

7. The electronics cooling arrangement as recited in claim 1 , wherein the electronic device includes an integrated circuit exposed to an interior of the housing.

8. The electronics cooling arrangement as recited in claim 1 , wherein the chip package includes a microchannel cooler in fluid communication with the passageway.

9. The electronics cooling arrangement as recited in claim 1 , wherein the chip package includes an integrated circuit.

10. An electronics cooling arrangement, comprising:

a housing configured to contain a coolant;

an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, the passageway configured to allow fluid flowing between the inlet and the outlet to cool the electronic device; and

a hypodermic needle segment fluidly coupling the inlet with the passageway.

11. An immersion cooling arrangement, comprising:

a sealed housing;

a dielectric coolant disposed within the housing;

an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, wherein the inlet is submerged within the dielectric coolant, wherein the outlet is submerged within the dielectric coolant, and wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing; and

a hypodermic needle segment fluidly coupling the inlet with the passageway.

12. A method of cooling an electronic device, comprising:

introducing fluid from an interior of a housing into a passageway defined by the electronic device, the electronic device including a printed circuit board (PCB) with a chip package coupled to by the PCB, wherein the coolant enters the passageway through an inlet defined by PCB,

flowing fluid through the passageway;

transferring heat from the electronic device to the fluid flowing through the passageway; and

flowing heated coolant through an outlet defined by the chip package, wherein the outlet opens directly to the interior of the housing.

13. The method of cooling an electronic device as recited in claim 12 , further comprising flowing heated coolant from the passageway into the interior of the housing.

14. The method of cooling an electronic device as recited in claim 12 , further comprising pumping coolant through the passageway.

Assignments (1)

Continuity (1)

Cited By (11)

US 12,200,901 US 12,309,965 US 12,384,419 US 12,408,308 US 12,501,580 US 12,516,752 US 12,557,241 US 12,563,696 US 12,568,822 US 12,610,502 US 12,666,569