Cooling apparatus

1. A cooling apparatus comprising:

an immersion tank having an upright position in an up-down direction and configured to store a refrigerant;

a refrigerant suction port formed at a lower portion of the immersion tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion tank into an inside of the immersion tank;

an electronic device immersed in the refrigerant, the electronic device including:

a first heat generation portion,

a second heat generation portion having a heat generation amount smaller than a heat generation amount of the first heat generation portion, and

a refrigerant inlet positioned below the first heat generation portion and the second heat generation portion and being open downward; and

a block positioned, in the up-down direction, under the first heat generation portion and the second heat generation portion, the block including:

a through-hole through which a region positioned, in the up-down direction, under the first heat generation portion in the refrigerant inlet is open, and

a closing portion that closes a region positioned, in the up-down direction, under the second heat generation portion in the refrigerant inlet;

wherein the block is directly connected to the electronic device, in the up-down direction, under the first heat generation portion and the second heat generation portion of the electronic device.

2. The cooling apparatus according to claim 1 , wherein

the refrigerant suction port is formed at a lower portion of a side wall of the immersion tank,

the block is positioned above the refrigerant suction port, and

a panel having a plurality of straightening holes penetrating the panel in an up-down direction of the immersion tank is disposed between the block and the refrigerant suction port.

3. The cooling apparatus according to claim 1 , wherein

the through-hole guides the refrigerant sucked from the refrigerant suction port, to the first heat generation portion, and

the closing portion blocks flowing of the refrigerant sucked from the refrigerant suction port, into the second heat generation portion.

4. The cooling apparatus according to claim 1 , wherein

the refrigerant suction port is formed below a lower surface of the electronic device, and

the block is fixed to the lower surface of the electronic device.

5. The cooling apparatus according to claim 1 ,

wherein the block has a specific gravity greater than a specific gravity of the refrigerant.

6. The cooling apparatus according to claim 1 ,

wherein a lower end of the block is positioned at a height same as a height of an upper edge of the refrigerant suction port.

7. The cooling apparatus according to claim 1 ,

wherein the closing portion closes a part of the region positioned below the second heat generation portion in the refrigerant inlet.

8. The cooling apparatus according to claim 1 , further comprising:

a first electronic device immersed in the refrigerant, the first electronic device having a refrigerant inlet that is entirely open downward; and

a second electronic device as the electronic device having a heat generation amount smaller than a heat generation amount of the first electronic device.

9. The cooling apparatus according to claim 1 , further comprising:

a plurality of the electronic device having lower ends positioned at different heights,

a plurality of the block attached to the plurality of electronic devices;

wherein lower ends of the plurality of blocks provided in the electronic devices are positioned at the same height.

10. The cooling apparatus according to claim 1 ,

wherein the block has a plurality of the through-hole.

11. The cooling apparatus according to claim 1 , wherein the immersion tank is one of a plurality of immersion tanks, and the cooling apparatus further includes:

a refrigerant supply device configured to supply the refrigerant to the plurality of immersion tanks being connected in parallel to the refrigerant supply device; and

a bypass unit configured to connect side walls of the plurality of immersion tanks and allow the refrigerant to flow between the immersion tanks.

12. The cooling apparatus according to claim 1 ,

wherein an opening area of the through-hole becomes smaller in an upward direction.

13. The cooling apparatus according to claim 1 ,

wherein the through-hole is formed at a position shifted from a center of the block.

14. A method for cooling a device, the device including a first heat generation portion and a second heat generation portion, the method comprising:

providing an opening in the electronic device, the opening positioned, in an up-down direction, under the first heat generation portion and the second heat generation portion;

providing a direct attachment to the electronic device, the attachment is connected to one end of the electronic device, in the up-down direction, under the first heat generation portion and the second heat generation portion device, the attachment including,

a through-hole configured to expose the region, in the up-down direction, under the first heat generation portion in the opening;

a closing portion configured to shield the region, in the up-down direction, under the second heat generation portion in the opening;

immersing the electronic device with the connected attachment in a container having a cooling substance;

cooling the electronic device by providing contacting of the cooling substance with the first heat generation portion through the through-hole while having the closing portion restricting contact of the cooling substance with the second heat generation portion.