Techniques for providing a semiconductor memory device
View Patent ↗Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region and a second region. The apparatus may also include a body region disposed between the first region and the second region and capacitively coupled to a plurality of word lines, wherein each of the plurality of word lines is capacitively coupled to different portions of the body region.
1. A method for manufacturing a semiconductor memory device comprising the steps of:
doping a semiconductor material to form a first region, a second region, and a body region disposed between the first region and the second region, wherein the first region and the second region have opposing charge concentrations, and wherein the body region is electrically floating;
forming at least one trench in the semiconductor material to expose side portions of the first region, the second region, and the body region;
depositing an insulating material in the at least one trench to cover at least the side portion of the body region; and
forming a plurality of word lines in the at least one trench, wherein each of the plurality of word lines is disposed apart from the side portion of the body region by the insulating material.
2. The method according to claim 1 , wherein forming at least one trench in the semiconductor material comprises forming at least one trench to expose at least two side portions of the first region, the second region, and the body region.
3. The method according to claim 2 , wherein forming a plurality of word lines in the at least one trench comprises forming a first word line disposed apart from a first side portion of the body region by the insulating material and a second word line disposed apart from a second side portion of the body region by the insulating material, wherein the first side portion is opposite the second side portion.
4. The method according to claim 1 , wherein the first region comprises an P-doped semiconductor material.
5. The method according to claim 4 , wherein the second region comprises an N-doped semiconductor material.
6. The method according to claim 1 , wherein the body region comprises an undoped semiconductor material.
7. The method according to claim 1 , wherein the first region, the second region, and the body region are formed on a substrate.
8. The method according to claim 7 , wherein the first region, the body region, the second region are formed in a sequential vertical configuration on the substrate.
9. The method according to claim 1 , wherein each of the plurality of word lines is capacitively coupled to a respective side portion of the body region.
10. The method according to claim 1 , wherein the plurality of word lines comprise a control word line.
11. The method according to claim 1 , wherein the plurality of word lines comprise a first word line and a second word line.
12. The method according to claim 11 , wherein the first word line is capacitively coupled to a first portion of the body region and the second word line is capacitively coupled to a second portion of the body region.
13. The method according to claim 12 , wherein the first portion of the body region and the second portion of the body region are different portions of the body region.
14. The method according to claim 11 , wherein at least a portion of the first word line overlaps at least a portion of the second word line.
15. The method according to claim 1 , wherein the first region is coupled to a bit line.
16. The method according to claim 15 , wherein the second region is coupled to a source line extending in the first orientation.
17. The method according to claim 16 , wherein the source line is coupled to a ground.
18. The method according to claim 1 , wherein each of the plurality of word lines are capacitively coupled to different side portions on a common side of the body region.
19. The method according to claim 1 , wherein each of the plurality of word lines are capacitively coupled to opposite side portions of the body region.