Surface-mount connector structure for embedded optical and electrical traces
A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face.
1. A method for forming a system for use with optical and electrical signaling in a printed circuit board that includes a plurality of layers vertically stacked between a first face and a second face, a first optical signal transmission path within a first internal layer of the plurality of layers and an electrical signal transmission path, the method comprising:
creating an opening in the printed circuit board that intersects the first optical signal transmission path and the electrical signal transmission path;
depositing an electrically conductive and optically reflective material in the opening;
removing an inner portion of the electrically conductive and optically reflective material to form a reflective surface that is configured to reflect light between the optical signal transmission path and an opening of the via on the first face; and
removing an outer portion of the electrically conductive material from the via to allow light from the optical signal transmission path to reach the reflective surface, while leaving a portion of the conductive material in the via in contact with the electrical signal transmission path.
2. The method of claim 1 , wherein removing an inner portion of the electrically conductive material and removing an outer portion of the electrically conductive material includes laser ablation.
3. The method of claim 1 , wherein the reflective surface has an angle, relative to light transmitted by the optical signal transmission path, sufficient to reflect the light to an opening of the via on the first face.
4. The method of claim 1 , further comprising removing electrically conductive material adjacent to the via on the first face from an outer layer of the plurality of layers.
5. The method of claim 4 , further comprising depositing dielectric material to replace electrically conductive material removed from a location adjacent to the via on the first face.