Flexible display and manufacturing method thereof
A method of manufacturing a flexible display includes: forming a first barrier layer on a flexible substrate; forming a second barrier layer including silicon nitride on the first barrier layer; releasing stress of the second barrier layer; forming a first buffer layer including silicon nitride on the second barrier layer; forming a second buffer layer on the first buffer layer; and forming a thin film transistor on the second buffer layer.
1. A method of manufacturing a flexible display, comprising:
forming a first barrier layer on a flexible substrate;
forming a second barrier layer comprising silicon nitride on the first barrier layer;
exposing the second barrier layer to the air in order to release stress of the second barrier layer and form an oxide film on the second barrier layer;
forming a first buffer layer comprising silicon nitride having the same film quality as the second barrier layer on the second barrier layer;
forming a second buffer layer on the first buffer layer; and
forming a thin film transistor on the second buffer layer.
2. The method of claim 1 , wherein
the flexible substrate comprises at least one polymer material layer comprising polyimide.
3. The method of claim 2 , wherein the flexible substrate includes:
a first flexible substrate;
an intermediate barrier layer formed on the first flexible substrate; and
a second flexible substrate formed on the intermediate barrier layer,
wherein the intermediate barrier layer comprises a same material as the first barrier layer.
4. The method of claim 3 , further comprising:
forming an adhesive layer between the first flexible substrate and the second flexible substrate,
wherein the adhesive layer comprises at least one of amorphous silicon on which a P-type or N-type conductive impurity is doped, or hydrogenated amorphous silicon.
5. The method of claim 3 , wherein
the intermediate barrier layer is formed to have a thickness of about 1000 Å to about 6000 Å.
6. The method of claim 3 , wherein
the first flexible substrate and the second flexible substrate comprise polyimide.
7. The method of claim 3 , wherein
each of the first flexible substrate and the second flexible substrate is formed to have a thickness of about 8 μm to about 12 μm.