Power modules and power module arrays having a modular design
View Patent ↗Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.
1. A power module comprising:
a module support comprising:
a heat spreader comprising a top surface; and
an electrically conductive rail extending from the module support;
a high temperature module comprising:
a module substrate having a semiconductor surface and a heat transfer surface, wherein the heat transfer surface contacts the top surface of the heat spreader, and wherein the heat transfer surface is detachable from the top surface of the heat spreader; and
a semiconductor device that is thermally coupled to the semiconductor surface of the module substrate and that is electrically coupled to the electrically conductive rail; and
a module cap comprising:
a body portion; and
a post extending from the body portion, wherein the post is configured to press against the semiconductor device such that the heat transfer surface of the module substrate is thermally coupled to the heat spreader.
2. The power module of claim 1 , wherein the semiconductor device is electrically coupled to the semiconductor surface.
3. The power module as claimed in claim 1 , wherein the module support further comprises an electrically conductive pad that is electrically coupled to the electrically conductive rail.
4. The power module as claimed in claim 1 , wherein the module cap further comprises a first post that presses against the module substrate and a second post that presses against the semiconductor device.
5. The power module as claimed in claim 1 , wherein the module cap further comprises an outer post, wherein the electrically conductive rail is disposed within the outer post.
6. The power module as claimed in claim 5 , wherein the outer post is electrically coupled to the electrically conductive rail.
7. The power module as claimed in claim 1 , wherein the high temperature module further comprises an external connector that is electrically coupled to the electrically conductive rail.
8. The power module as claimed in claim 7 , wherein the module cap comprises further comprises a first post that presses against the module substrate and a second post that presses against the external connector.
9. The power module as claimed in claim 1 , the post is configured to press against a top surface of the semiconductor device.
10. A power module array comprising:
a first power module and a second power module, each of the first power module and the second power module comprising:
a module support comprising:
a heat spreader comprising a top surface; and
an electrically conductive rail extending from the module support;
a high temperature module comprising:
a module substrate having a semiconductor surface and a heat transfer surface, wherein the heat transfer surface contacts the top surface of the heat spreader, and wherein the heat transfer surface is detachable from the top surface of the heat spreader; and
a semiconductor device that is thermally coupled to the semiconductor surface of the module substrate and that is electrically coupled to the electrically conductive rail; and
a module cap comprising:
a body portion; and
a post extending from the body portion, wherein the post is configured to press against the semiconductor device such that the heat transfer surface of the module substrate is thermally coupled to the heat spreader.
11. The power module array as claimed in claim 10 , wherein the module support further comprises an electrically conductive pad that is electrically coupled to the electrically conductive rail.
12. The power module array as claimed in claim 10 , wherein the module cap further comprises a first post that presses against the module substrate and a second post that presses against a top surface of the semiconductor device.
13. The power module array as claimed in claim 10 , wherein the module cap further comprises an outer post, wherein the electrically conductive rail is disposed within the outer post.