IP Library Patent Application 14466186
Patent Application
App. No. 14/466,186

PLASMA CVD APPARATUS, METHOD FOR FORMING FILM AND DLC-COATED PIPE

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Quick Facts
Patent No.
US None
App. No.
14/466,186
Abstract

To provide a plasma CVD apparatus capable of forming a thin film on the inner surface of a pipe even without a vacuum vessel. An aspect of the present invention is a plasma CVD apparatus including a first member sealing an end of a pipe; a second member sealing the other end of the pipe; a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe; an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe; an electrode disposed in the pipe; and a high-frequency power.

Claims (62)

1 . A plasma CVD apparatus comprising:

a first member sealing an end of a pipe;

a second member sealing the other end of the pipe;

a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe;

an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe;

an electrode disposed in the pipe; and

a high-frequency power source electrically connected to the electrode or the pipe.

2 . The plasma CVD apparatus according to claim 1 , wherein an earth is electrically connected to the pipe or the electrode.

3 . The plasma CVD apparatus according to claim 1 , wherein the high-frequency power source has a frequency of 10 kHz to 1 MHz.

4 . The plasma CVD apparatus according to claim 1 , wherein the high-frequency power source has a frequency of 50 kHz to 500 kHz.

5 . A plasma CVD apparatus, comprising:

a first member sealing an end of a pipe;

a second member sealing the other end of the pipe;

a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe;

an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe;

an electrode disposed in the pipe;

a first high-frequency power source that is electrically connected to the pipe and that has a frequency of 10 kHz to 1 MHz;

a second high-frequency power source that is electrically connected to the pipe and that has a frequency of 2 MHz to 100 MHz; and

an earth electrically connected to the electrode.

6 . A plasma CVD apparatus, comprising:

a first member sealing an end of a pipe;

a second member sealing the other end of the pipe;

a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe;

an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe;

an electrode disposed in the pipe;

a first high-frequency power source that is electrically connected to the electrode and that has a frequency of 10 kHz to 1 MHz;

a second high-frequency power source that is electrically connected to the electrode and that has a frequency of 2 MHz to 100 MHz; and

an earth electrically connected to the pipe.

7 . A plasma CVD apparatus, comprising:

a first member sealing an end of a pipe;

a second member sealing the other end of the pipe;

a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe;

an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe;

an electrode disposed in the pipe;

a first high-frequency power source that is electrically connected to the pipe and that has a frequency of 10 kHz to 1 MHz; and

a second high-frequency power source that is electrically connected to the electrode and that has a frequency of 2 MHz to 100 MHz.

8 . A plasma CVD apparatus, comprising:

a first member sealing an end of a pipe;

a second member sealing the other end of the pipe;

a gas introduction mechanism that is connected to the first member and that introduces a raw material gas into the pipe;

an exhausting mechanism that is connected to the second member and that vacuum-exhausts the inside of the pipe;

an electrode disposed in the pipe;

a first high-frequency power source that is electrically connected to the electrode and that has a frequency of 10 kHz to 1 MHz; and

a second high-frequency power source that is electrically connected to the pipe and that has a frequency of 2 MHz to 100 MHz.

9 . The plasma CVD apparatus according to claim 1 , wherein each of the first member and the second member has a vacuum sealing member to be contacted with an end part of the pipe.

10 . The plasma CVD apparatus according to claim 5 , wherein each of the first member and the second member has a vacuum sealing member to be contacted with an end part of the pipe.

11 . The plasma CVD apparatus according to claim 9 , wherein each of the first member and the second member has an insulating member disposed in contact with the vacuum sealing member.

12 . The plasma CVD apparatus according to claim 1 , including a plurality of earth plates disposed in a vicinity of at least one of the first member and the second member and inside the pipe.

13 . The plasma CVD apparatus according to claim 5 , including a plurality of earth plates disposed in a vicinity of at least one of the first member and the second member and inside the pipe.

14 . The plasma CVD apparatus according to claim 12 , wherein mutual distance between the plurality of earth plates is preferably 5 mm or less.

15 . The plasma CVD apparatus according to claim 12 , wherein mutual distance between the plurality of earth plates is preferably 3 mm or less.

16 . The plasma CVD apparatus according to claim 5 , wherein the exhausting mechanism has a gas-gathering member gathering gas inside the pipe.

17 . A method for forming a film, comprising the steps of:

sealing both ends of a pipe;

introducing a raw material gas into the pipe; and

forming a film on an inner surface of the pipe by a plasma CVD method by supplying a high-frequency output to the inside of the pipe.

18 . The method for forming a film according to claim 17 , wherein the high-frequency output has a frequency of 10 kHz to 1 MHz.

19 . The method for forming a film according to claim 17 , wherein both a high-frequency output having a frequency of 2 MHz to 100 MHz and a high-frequency output having a frequency of 10 kHz to 1 MHz are supplied to the inside of the pipe.

20 . A DLC-coated pipe, comprising:

a pipe; and

a DLC film formed on the inner surface of the pipe.

21 . The DLC-coated pipe according to claim 20 , wherein the pipe is a metallic pipe, or a ceramics pipe, or a resin pipe.

Assignments (2)
CHANGE OF NAME Recorded Jun 29, 2018
From: YOUTEC CO., LTD.
To: ADVANCED MATERIAL TECHNOLOGIES, INC.
Reel/Frame 046463/0924 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2014
From: HONDA, YUUJI; ARAMAKI, NORIO
To: YOUTEC CO., LTD.
Reel/Frame 033921/0644 →