IP Library Granted Patent US 9,177,825
Granted Patent B2
US 9,177,825 · App. 14/467,213 · Granted Nov 3, 2015

Pattern forming method

Inventor: Yuriko Seino (Tokyo, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
H01L21/31144H01L21/0275H01L21/02118H01L21/31138
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Quick Facts
Patent No.
US 9,177,825
App. No.
14/467,213
Granted
Nov 3, 2015
Kind
B2
Abstract

According to one embodiment, a pattern forming method includes forming, on an underlying region, a neutral film having an affinity for first and second polymers, forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam, forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers, and performing a predetermined treatment for the block copolymer film to perform a microphase separation.

Claims (61)

1. A pattern forming method comprising:

forming, on an underlying region, a neutral film having an affinity for first and second polymers;

forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam;

forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers;

forming, on the first pinning part, a pattern including first and second portions formed of the first polymer and a third portion provided between the first and second portions and formed of the second polymer, by performing a predetermined treatment for the block copolymer film to perform a microphase separation; and

removing the first and second portions or removing the third portion,

wherein forming the neutral film includes:

forming a preliminary neutral film; and

thinning a portion of the preliminary neutral film, which is formed in the first region.

2. The method of claim 1 , wherein

a horizontal lamella orientation section is formed in a predetermined region outside the first pinning part in performing the predetermined treatment for the block copolymer film.

3. The method of claim 2 , wherein

the horizontal lamella orientation section includes a structure in which a portion formed of the first polymer and a portion formed of the second polymer are stacked.

4. The method of claim 1 , wherein

the energy beam is selected from an electron beam and light.

5. The method of claim 1 , wherein

the predetermined treatment includes heat treatment.

6. The method of claim 1 , wherein

the first polymer is polymethyl methacrylate (PMMA) and the second polymer is polystyrene (PS).

7. The method of claim 1 , wherein

a line-and-space pattern is formed by removing the first and second portions or removing the third portion.

8. The method of claim 1 , wherein

a second pinning part having an affinity for the first polymer is formed by irradiating a second region of the neutral film with an energy beam, in forming the first pinning part; and

a pattern including fourth and fifth portions formed of the first polymer and a sixth portion provided between the fourth and fifth portions and formed of the second polymer is formed on the second pinning part, and a pattern including seventh and eighth portions formed of the second polymer and a ninth portion provided between the seventh and eighth portions and formed of the first polymer is formed between the first and second pinning parts, in forming the pattern including the first, second and third portions.

9. A pattern forming method comprising:

forming, on an underlying region, a neutral film having an affinity for first and second polymers;

forming first and second pinning parts having an affinity for the first polymer by irradiating first and second regions of the neutral film with an enemy beam;

forming, on the neutral film including the first and second pinning parts, a block copolymer film containing the first and second polymers;

forming a pattern formed of the first polymer, on the first pinning part, on the second pinning part and on a art provided between the first and second pinning arts and separated from the first and second pinning parts, by performing predetermined treatment for the block copolymer film to perform a microphase separation; and

removing the pattern formed of the first polymer,

wherein forming the neutral film includes:

forming a preliminary neutral film; and

thinning a portion of the preliminary neutral film, which is formed in the first and second regions.

10. The method of claim 9 , wherein

the energy beam is selected from an electron beam and light.

11. The method of claim 9 , wherein

the predetermined treatment includes heat treatment.

12. The method of claim 9 , wherein

the first polymer is polymethyl methacrylate (PMMA) and the second polymer is polystyrene (PS).

13. The method of claim 9 , wherein

a hole pattern is formed by removing the pattern formed of the first polymer.

14. A pattern forming method comprising:

forming, on an underlying region, a neutral film having an affinity for first and second polymers;

forming a first pinning part having an affinity for the first polymer by irradiating a first region of the neutral film with an energy beam;

forming, on the neutral film including the first pinning part, a block copolymer film containing the first and second polymers;

forming, on the first pinning part, a pattern including first and second portions formed of the first polymer and a third portion provided between the first and second portions and formed of the second polymer, by performing a predetermined treatment for the block copolymer film to perform a microphase separation; and

removing the first and second portions or removing the third portion,

wherein a horizontal lamella orientation section is formed in a predetermined region outside the first pinning part in performing the predetermined treatment for the block copolymer film.

15. The method of claim 14 , wherein

a second pinning part having an affinity for the first polymer is formed by irradiating a second region of the neutral film with an energy beam, in forming the first pinning part; and

a pattern including fourth and fifth portions formed of the first polymer and a sixth portion provided between the fourth and fifth portions and formed of the second polymer is formed on the second pinning part, and a pattern including seventh and eighth portions formed of the second polymer and a ninth portion provided between the seventh and eighth portions and formed of the first polymer is formed between the first and second pinning parts, in forming the pattern including the first, second and third portions.

16. The method of claim 14 , wherein

the horizontal lamella orientation section includes a structure in which a portion formed of the first polymer and a portion formed of the second polymer are stacked.

17. The method of claim 14 , wherein

the energy beam is selected from an electron beam and light.

18. The method of claim 14 , wherein

the predetermined treatment includes heat treatment.

19. The method of claim 14 , wherein

the first polymer is polymethyl methacrylate (PMMA) and the second polymer is polystyrene (PS).

20. The method of claim 14 , wherein

a line-and-space pattern is formed by removing the first and second portions or removing the third portion.

Assignments (4)
MERGER Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION; K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051679/0042 →
DE-MERGER Recorded Jan 31, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051762/0119 →
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051762/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2014
From: SEINO, YURIKO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033600/0343 →
Priority Claims (1)
JP 2014-052138 · Mar 14, 2014 · national
Continuity (1)
Related Publication 20150262837A1 · Sep 17, 2015