LED FIXTURE APPARATUS AND MANUFACTURING METHODS THERETO
An improved led fixture apparatus and manufacturing methods thereto is disclosed herein. In preferred embodiments, the apparatus comprises a power supply, a base, a circuit board mounted within the base, a LED connected to the circuit board, and wherein the base is constructed from material comprising forged metal and configured to act as a heat sync. In preferred embodiments, the base is made from forged aluminum alloy anodized for emissivity conduction and comprises a plurality of fins adapted to increase the surface area of the base to improve heat dissipation.
1 . An improved LED fixture apparatus, the apparatus comprising:
a. a power supply;
b. a base;
c. a circuit board mounted within the base;
d. a LED connected to the circuit board; and
wherein the base is constructed from material comprising forged metal and configured to act as a heat sync.
2 . The apparatus of claim 1 , wherein the base comprises a plurality of fins adapted to increase the surface area of the base to improve heat dissipation.
3 . The apparatus of claim 2 , wherein the base is constructed from forged aluminum alloy anodized for emissivity conduction.
4 . The apparatus of claim 1 , wherein the base comprises a mounting shelf coated with a thermally conductive material and where said mounting shelf is configured to connect the base to a circuit board.
5 . The apparatus of claim 4 , wherein the thermally conductive material comprises zinc oxide.
6 . The apparatus of claim 4 , wherein the thermally conductive material comprises copper.
7 . The apparatus of claim 1 , wherein the circuit board comprises a first circuit board wire conduit configured to accept a power supply wire.
8 . The apparatus of claim 7 , wherein the circuit board comprises a second circuit board wire conduit configured to accept a power supply wire.
9 . The apparatus of claim 8 , wherein the first circuit board wire conduit and the second circuit board wire conduit are co-located proximate to each other within the center region of the circuit board.
10 . The apparatus of claim 9 , wherein the first and second power supply wires are connected to the circuit board by mechanical crimping.
11 . The apparatus of claim 1 , wherein the power supply comprises a first insulated wire and a second insulated wire, said first and second insulated wire connected to the circuit board by mechanical crimping.
12 . The apparatus of claim 1 , wherein the power supply comprises a first insulated wire and a second insulated wire.
13 . The apparatus of claim 12 , where the first insulated wire and second insulated wire contain a hardened copper core.
14 . The apparatus of claim 1 , wherein the base further comprises a base plug constructed of thermally conductive and electrically insulative material.
15 . The apparatus of claim 1 , wherein the thermally conductive and electrically insulative material is a thermally conductive thermoplastic elastomer.
16 . A base of uni-body design configured to act as a heat sync, the base constructed from forged metallic material and comprising a plurality of heat dissipating fins.
17 . The base of claim 16 , wherein the base is constructed from forged aluminum alloy.
18 . The base of claim 16 , wherein the base comprises a mounting shelf coated with a thermally conductive material and said mounting shelf is configured to connect the base to a circuit board.
19 . The base of claim 16 , wherein the thermally conductive material comprises zinc oxide and copper.
20 . The base of claim 16 , wherein the circuit board comprises a first circuit board wire conduit configured to accept a socket connector wire and said socket connector wire is mechanically crimped to the circuit board.