Memory module in a package
View Patent ↗A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals.
1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces;
at least two pairs of microelectronic elements, each pair of microelectronic elements including an upper microelectronic element and a lower microelectronic element, the pairs of microelectronic elements being fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate, each lower microelectronic element having a front surface facing the first surface of the substrate and a plurality of contacts at the front surface, the front surfaces of the lower microelectronic elements being arranged in a single plane parallel to the first surface, a surface of each of the upper microelectronic elements at least partially overlying a rear surface of the lower microelectronic element in its pair, the microelectronic elements together configured to predominantly provide memory storage array function;
a plurality of terminals exposed at the second surface, the terminals configured for connecting the microelectronic package to at least one component external to the microelectronic package; and
electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals,
wherein at least one of the upper or lower microelectronic elements of each pair of microelectronic elements at least partially overlies an aperture extending between the first and second surfaces of the substrate, and wherein each aperture has a length defining respective first and second axes, the first and second axes being transverse to one another.
2. The microelectronic package as claimed in claim 1 , wherein the at least two pairs of microelectronic elements includes four pairs of microelectronic elements.
3. The microelectronic package as claimed in claim 1 , wherein the lower microelectronic element of at least one of the pairs of the microelectronic elements is a first lower microelectronic element disposed adjacent a second lower microelectronic element, the front surface of the second lower microelectronic element being arranged in the single plane parallel to the first surface, and wherein the upper microelectronic element that at least partially overlies the first lower microelectronic element also at least partially overlies the second lower microelectronic element.
4. The microelectronic package as claimed in claim 1 , wherein the electrical connections include flip-chip connections extending between contacts of each of the lower microelectronic elements and conductive bond pads exposed at the first surface of the substrate.
5. The microelectronic package as claimed in claim 1 , wherein each of the lower microelectronic elements overlies at least one of the apertures extending between the first and second surfaces of the substrate, and wherein the electrical connections include leads having at least portions aligned with the at least one of the apertures.
6. The microelectronic package as claimed in claim 5 , wherein each of the upper microelectronic elements overlies at least one of the apertures extending between the first and second surfaces of the substrate, and wherein the electrical connections include leads having at least portions aligned with the at least one of the apertures.
7. The microelectronic package as claimed in claim 5 , wherein at least some of the leads include wire bonds extending through the at least one of the apertures.
8. The microelectronic package as claimed in claim 1 , wherein the microelectronic elements are configured to function together as an addressable memory module, the microelectronic package configured to store part of data received in each of the microelectronic elements.
9. The microelectronic package as claimed in claim 8 , wherein the microelectronic package is configured to function as a dual in-line memory module.
10. The microelectronic package as claimed in claim 9 , wherein the microelectronic package has the same command and signal interface and is configured to transfer the same amount of data as a dual in-line memory module.
11. A microelectronic assembly including a plurality of microelectronic packages as claimed in claim 1 , further comprising a circuit panel having panel contacts, wherein the terminals of the package are bonded to the panel contacts.
12. A module including a plurality of microelectronic assemblies as claimed in claim 11 , each microelectronic assembly electrically coupled to a second circuit panel for transport of signals to and from each of the microelectronic assemblies.
13. A system comprising a microelectronic package according to claim 1 , and one or more other electronic components electrically connected to the microelectronic package.
14. The system as claimed in claim 13 , further comprising a housing, the microelectronic package and the other electronic components being mounted to the housing.
15. The microelectronic package as claimed in claim 1 , further comprising a buffer element electrically connected to at least some of the terminals and one or more of the microelectronic elements in the microelectronic package, the buffer element configured to regenerate at least one signal received at one or more of the terminals of the microelectronic package, wherein the at least one signal includes all of the address signals transferred to the microelectronic package.
16. The microelectronic package as claimed in claim 15 , wherein the at least one signal includes all of the command signals, address signals, bank address signals, and clock signals transferred to the microelectronic package, the command signals being write enable, row address strobe, and column address strobe signals, and the clock signals being sampling clocks used for sampling the address signals.
17. The microelectronic package as claimed in claim 15 , wherein the at least one signal includes all of the data signals received by the microelectronic package.
18. The microelectronic package as claimed in claim 15 , wherein the buffer element is mounted to the first surface of the substrate.
19. The microelectronic package as claimed in claim 15 , wherein the buffer element is mounted to the second surface of the substrate.