Detachment mechanisms for implantable devices
View Patent ↗The present invention relates to detachment mechanisms for delivering and releasing implantable devices into a body lumen. According to certain aspects, systems of the invention include a junction that couples an implantable device to a delivery member. The junction includes an anodic portion and a cathodic portion galvanically coupled to the anodic portion such that the anodic portion corrodes when exposed to an electrolytic fluid, thereby detaching the implantable device from the delivery member without application of energy from an external power source.
1. A system for delivering an implantable device into a body lumen, the system comprising:
an implantable device;
a delivery member having first and second ends; and
a junction coupling the implantable device to the delivery member, the junction comprising:
a tubular anodic portion surrounding a portion of the first end of the delivery member; and
a tubular cathodic portion having opposing first and second ends, with the first end overlapping a portion of the anodic portion and a portion of the first end of the delivery member without directly contacting the delivery member, in a manner such that the anodic portion extends beyond the first end of the delivery member, and the second end of the cathodic portion overlapping a portion of the implantable device.
2. The system of claim 1 , wherein the anodic portion corrodes when exposed to an electrolytic fluid, thereby detaching the implantable device from the delivery member without application of energy from an external power source.
3. The system of claim 2 , wherein the electrolytic fluid is selected from the group consisting of blood, saline, and a combination thereof.
4. The system of claim 1 , wherein the anodic portion is formed on and overlaps a distal end of the delivery member, and the first end of the cathodic portion overlaps a proximal end of the implantable device.
5. The system of claim 1 , wherein the anodic portion is formed on the delivery member by dipping, physical deposition, chemical deposition, laser deposition/sputtering, or plating.
6. The system of claim 1 , wherein the cathodic portion comprises a material selected from the group consisting of platinum, platinum alloys, platinum-iridium alloys, tantalum, stainless steel, nickel-titanium alloys, and cobalt-chromium alloys.
7. The system of claim 1 , wherein the anodic portion comprises a material selected from the group consisting of magnesium and magnesium alloys.