IP Library › Granted Patent US 9,332,659
Granted Patent B2
US 9,332,659 · App. 14/477,156 · Granted May 3, 2016

Electronic component case and electronic component device

Inventors: Minshong Tan (Nagano, JP); Syuzo Aoki (Nagano, JP); Takuya Oda (Nagano, JP)
Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
H05K5/0008
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Quick Facts
Patent No.
US 9,332,659
App. No.
14/477,156
Granted
May 3, 2016
Kind
B2
Abstract

An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Claims (30)

1. An electronic component case, comprising:

a lower case including

a bottom plate,

a side wall having a protruding portion,

an engaging projection formed on an outer face of the side wall, and

a screw hole formed in the side wall in a region where the protruding portion is provided; and

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a notched hole formed in the side wall of the top plate side, wherein

the protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case.

2. The electronic component case according to claim 1 , wherein

an outer edge part of the protruding portion of the side wall of the lower case is chamfered, and

an inner edge part of the side wall of the upper case in a region where the notched hole is provided is chamfered.

3. The electronic component case according to claim 1 , wherein the upper case and the lower case are formed of any one of pure aluminum and an aluminum-magnesium alloy.

4. An electronic component device, comprising:

a lower case including

a bottom plate,

a side wall having a protruding portion,

an engaging projection formed on an outer face of the side wall, and

a screw hole formed in the side wall in a region where the protruding portion is provided;

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a notched hole formed in the side wall on the top plate side; and

an electronic component housed between the lower case and the upper case, wherein

the protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case.

5. The electronic component device according to claim 4 , wherein the electronic component is a memory element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2014
From: TAN, MINSHONG; AOKI, SYUZO; ODA, TAKUYA
To: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Reel/Frame 033800/0235 →
Priority Claims (1)
JP 2013-201828 · Sep 27, 2013 · national
Continuity (1)
Related Publication 20150092337A1 · Apr 2, 2015