IP Library Granted Patent US 10,633,762
Granted Patent B2
US 10,633,762 · App. 14/478,512 · Granted Apr 28, 2020

Method for producing bulk silicon carbide by sublimation of a silicon carbide precursor prepared from silicon and carbon particles or particulate silicon carbide

Inventors: Roman V. Drachev (Bedford, NH); Parthasarathy Santhanaraghavan (Nashua, NH); Andriy M. Andrukhiv (Hollis, NH); David S. Lyttle (Amherst, NH)
Assignee: GTAT Corporation.
C30B23/00C30B23/005C30B29/36
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Quick Facts
Patent No.
US 10,633,762
App. No.
14/478,512
Granted
Apr 28, 2020
Kind
B2
Abstract

A method of producing silicon carbide is disclosed. The method comprises the steps of providing a sublimation furnace comprising a furnace shell, at least one heating element positioned outside the furnace shell, and a hot zone positioned inside the furnace shell surrounded by insulation. The hot zone comprises a crucible with a silicon carbide precursor positioned in the lower region and a silicon carbide seed positioned in the upper region. The hot zone is heated to sublimate the silicon carbide precursor, forming silicon carbide on the bottom surface of the silicon carbide seed. Also disclosed is the sublimation furnace to produce the silicon carbide as well as the resulting silicon carbide material.

Claims (40)

1. A method of forming silicon carbide comprising the steps of

i) providing a sublimation furnace comprising a furnace shell, at least one heating element positioned outside the furnace shell, and a hot zone positioned inside the furnace shell surrounded by insulation, the hot zone comprising

a) a crucible having an upper region and a lower region;

b) a crucible cover sealing the crucible;

c) a source module that is separable from a lower region of the crucible and prepared outside of the crucible, wherein the source module includes a substantially solid silicon carbide precursor mixture comprising silicon carbide that is contained within an outer annual chamber of the source module, wherein the substantially solid silicon carbide precursor mixture is porous and has a density that is less than a density of silicon carbide, further wherein the source module is a cylindrical insert that, when inserted in the lower region of the crucible, forms an inner annular chamber; and

d) a silicon carbide seed positioned in the upper region of the crucible, the silicon carbide seed having a top surface and a bottom surface, the bottom surface facing the substantially solid silicon carbide precursor mixture;

ii) after inserting the source module in the lower region of the crucible, heating the hot zone with the heating element to sublimate the substantially solid silicon carbide precursor mixture included in the source module;

iii) forming silicon carbide on the bottom surface of the silicon carbide seed; and

iv) removing the source module including the substantially solid silicon carbide precursor mixture.

2. The method of claim 1 , wherein the substantially solid silicon carbide precursor mixture is prepared by providing the source module and heating the source module to form the substantially solid silicon carbide precursor mixture.

3. The method of claim 1 , wherein the source module comprises a precursor chamber and wherein the substantially solid silicon carbide precursor mixture is contained within the precursor chamber.

4. The method of claim 1 , wherein the substantially solid silicon carbide precursor mixture has a molar ratio of carbon to silicon of greater than 1.0.

5. The method of claim 4 , wherein the molar ratio of carbon to silicon is from 1.05 to 1.5.

6. The method of claim 4 , wherein the molar ratio of carbon to silicon is from 1.1 to 1.3.

7. The method of claim 1 , wherein the silicon particles have an average particle size of from 0.1 mm to 10 mm.

8. The method of claim 7 , wherein the silicon particles have an average particle size of from 0.1 mm to 10 mm.

9. The method of claim 7 , wherein the silicon particles have an average particle size of from 1 mm to 4 mm.

10. The method of claim 1 , wherein the carbon particles have an average particle size of from 50 microns to 1000 microns.

11. The method of claim 7 , wherein the carbon particles have an average particle size of from 50 microns to 1000 microns.

12. The method of claim 10 , wherein the carbon particles have an average particle size of from 85 microns to 500 microns.

13. The method of claim 1 , wherein the substantially solid silicon carbide precursor mixture is a heterogeneous mixture of silicon particles and carbon particles.

14. The method of claim 13 , wherein the substantially solid silicon carbide precursor mixture comprises alternating layers of silicon particles and carbon particles.

15. A method of forming silicon carbide comprising the steps of

i) providing a sublimation furnace comprising a furnace shell, at least one heating element positioned outside the furnace shell, and a hot zone positioned inside the furnace shell surrounded by insulation, the hot zone comprising

a) a crucible having an upper region and a lower region;

b) a crucible cover sealing the crucible;

c) a source module that is separable from a lower region of the crucible and prepared outside of the crucible, wherein the source module includes a substantially solid silicon carbide precursor mixture comprising silicon carbide that is contained within an outer annual chamber of the source module, wherein the substantially solid silicon carbide precursor mixture is porous and has a density that is less than a density of silicon carbide, further wherein the source module is a cylindrical insert that, when inserted in the lower region of the crucible, forms an inner annular chamber; and

d) a silicon carbide seed positioned in the upper region of the crucible, the silicon carbide seed having a top surface and a bottom surface, the bottom surface facing the substantially solid silicon carbide precursor mixture;

ii) after inserting the source module in the lower region of the crucible, heating the hot zone with the heating element to sublimate the substantially solid silicon carbide precursor mixture included in the source module; and

iii) forming silicon carbide on the bottom surface of the silicon carbide seed; and

iv) removing the source module including the substantially solid silicon carbide precursor mixture.

16. A method of forming silicon carbide comprising the steps of

i) preparing a source module that is separable from a lower region of a crucible and prepared outside of the crucible, wherein the source module includes a substantially solid silicon carbide precursor mixture comprising silicon carbide that is contained within an outer annual chamber of the source module, wherein the substantially solid silicon carbide precursor mixture is porous and has a density that is less than a density of silicon carbide, further wherein the source module is a cylindrical insert that when inserted in the lower region of the crucible, forms an inner annular chamber;

ii) after preparing the source module, providing a sublimation furnace comprising a furnace shell, at least one heating element positioned outside the furnace shell, and a hot zone positioned inside the furnace shell surrounded by insulation, the hot zone comprising:

a) the crucible having an upper region and the lower region,

b) a crucible cover sealing the crucible, and

c) a silicon carbide seed positioned in the upper region of the crucible, the silicon carbide seed having a top surface and a bottom surface, the bottom surface facing the substantially solid silicon carbide precursor mixture;

iii) after inserting the source module in the lower region of the crucible, heating the hot zone with the heating element to sublimate the substantially solid silicon carbide precursor mixture included in the source module;

iv) forming silicon carbide on the bottom surface of the silicon carbide seed; and

v) removing the source module including the substantially solid silicon carbide precursor mixture.

Assignments (8)
SECURITY INTEREST Recorded Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 058725, FRAME 0379 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: GTAT CORPORATION, AS GRANTOR; GTAT IP HOLDING LLC, AS GRANTOR
Reel/Frame 064067/0187 →
SECURITY INTEREST Recorded Jan 21, 2022
From: GTAT CORPORATION; GTAT IP HOLDING LLC; BY: GTAT TERRA INC., ITS SOLE MEMBER
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058725/0379 →
TERMINATION OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 29, 2021
From: CANTOR FITZGERALD SECURITIES (AS COLLATERAL AGENT)
To: GTAT CORPORATION
Reel/Frame 057972/0098 →
SECURITY INTEREST Recorded Oct 4, 2018
From: GTAT CORPORATION
To: CANTOR FITZGERALD SECURITIES, AS COLLATERAL AGENT
Reel/Frame 047073/0785 →
RELEASE OF SECURITY INTEREST Recorded May 16, 2017
From: UMB BANK, NATIONAL ASSOCIATION
To: GTAT CORPORATION
Reel/Frame 042479/0517 →
SECURITY INTEREST Recorded Mar 25, 2016
From: GTAT CORPORATION
To: UMB BANK, NATIONAL ASSOCIATION
Reel/Frame 038260/0341 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: DRACHEV, ROMAN V.; PARTHASARATHY, SANTHANARAGHAVAN; ANDRUKHIV, ANDRIY M.; LYTTLE, DAVID S.
To: GTAT CORPORATION
Reel/Frame 033804/0528 →