Memory arrays
The invention includes semiconductor constructions having trenched isolation regions. The trenches of the trenched isolation regions can include narrow bottom portions and upper wide portions over the bottom portions. Electrically insulative material can fill the upper wide portions while leaving voids within the narrow bottom portions. The trenched isolation regions can be incorporated into a memory array, and/or can be incorporated into an electronic system. The invention also includes methods of forming semiconductor constructions.
1. A memory array, comprising:
a semiconductor substrate;
a trench extending into the substrate and comprising an upper portion over a lower portion;
a liner comprising a single layer in the trench against at least a portion of the semiconductor substrate and extending along peripheral walls of the trench into the upper portion and the lower portion, the liner comprising a first thickness in the upper portion and a second thickness in the lower portion, the second thickness greater than the first thickness, the first thickness of the liner joined at the second thickness of the liner at a step;
an electrically insulative material substantially filling at least the lower portion of the trench; and
at least two transistors over the semiconductor substrate, the electrically insulative material electrically isolating the at least two transistors.
2. The memory array of claim 1 wherein the electrically insulative material and the liner comprise the same composition of material.
3. The memory array of claim 1 wherein the electrically insulative material and the liner comprise different compositions of material.
4. The memory array of claim 1 wherein the liner comprises silicon nitride.
5. The memory array of claim 1 wherein the liner comprises the only liner in the trench.
6. The memory array of claim 1 wherein the electrically insulative material comprises silicon dioxide and the liner comprises silicon nitride.
7. The memory array of claim 1 further comprising a void within the electrically insulative material, the void being devoid of material.
8. The memory array of claim 1 further comprising a void within the electrically insulative material, the void having a composition of material different from the composition of the electrically insulative material.
9. The memory array of claim 1 wherein the electrically insulative material substantially fills the upper portion of the trench.
10. The memory array of claim 1 wherein an entirety of the liner in the lower portion of the trench contacts the semiconductor substrate.
11. The memory array of claim 1 wherein an entirety of the liner in the upper portion of the trench contacts the semiconductor substrate.
12. The memory array of claim 1 wherein the step of the liner comprises a curved shape.
13. The memory array of claim 1 wherein the step of the liner comprises a concave shape.
14. The memory array of claim 1 wherein the trench comprises sidewalls and a bottom wall, and wherein the liner contacts the sidewalls and the bottom wall.
15. The memory array of claim 1 wherein the trench comprises a periphery in the semiconductor substrate, and wherein the liner contacts an entirety of the periphery of the trench.
16. A memory array, comprising:
a semiconductor substrate;
a trench extending into the substrate and comprising an upper portion over a lower portion;
a liner extending along and against peripheral walls of the trench into only the lower portion of the trench;
an electrically insulative material and a void substantially filling at least the lower portion of the trench; and
at least two transistors over the semiconductor substrate, the electrically insulative material electrically isolating the at least two transistors.
17. The memory array of claim 16 wherein the electrically insulative material and the liner comprise the same composition of material.
18. The memory array of claim 16 wherein the electrically insulative material and the liner comprise different compositions of material.
19. The memory array of claim 16 wherein the liner comprises silicon nitride.
20. The memory array of claim 16 wherein the liner comprises the only liner in the trench.
21. The memory array of claim 16 wherein the electrically insulative material comprises silicon dioxide and the liner comprises silicon nitride.
22. The memory array of claim 16 wherein the void is devoid of material.
23. The memory array of claim 16 wherein the void having a composition of material different from the composition of the electrically insulative material.
24. The memory array of claim 16 wherein the void comprises a composition of material.
25. The memory array of claim 24 wherein the composition of material differs from the electrically insulative material.
26. The memory array of claim 25 wherein the difference between the composition of material and the electrically insulative material is one or more of phase, density and chemical composition.