IP Library Patent Application 14483260
Patent Application
App. No. 14/483,260

APPOINTING SEMICONDUCTOR DICE TO ENABLE HIGH STACKING CAPABILITY

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Quick Facts
Patent No.
US None
App. No.
14/483,260
Abstract

Briefly, in accordance with one or more embodiments, a memory array comprises two or more volumes, the volumes comprising two or more dice, respectively. The volumes are connected in a daisy chain configuration such that an output of a first volume is coupled to an input of a next volume, and the dice are connected in a daisy chain configuration such that an output of a first die is coupled to an input of a next die within the volume. In such a configuration, a first die in a first volume is capable of being appointed as part of a second volume.

Claims (37)

1 . A memory array comprising:

two or more volumes, the volumes comprising two or more dice, respectively;

wherein the volumes are connected in a daisy chain configuration such that an output of a first volume is coupled to an input of a next volume; and

wherein the dice are connected in a daisy chain configuration such that an output of a first die is coupled to an input of a next die within the volume.

2 . A memory array as claimed in claim 1 , wherein the volumes are disposed in a stacked configuration.

3 . A memory device as claimed in claim 1 , wherein the daisy chain configuration of the dice is part of the daisy chain configuration of the volumes such that an input of a volume is coupled to an input of a first die within the volume and an output of a last die of the volume is coupled to an output of the volume.

4 . A memory array as claimed in claim 1 , wherein a first die in a first volume is capable of being appointed as part of a second volume.

5 . A memory array as claimed in claim 1 , wherein the dice may be powered up in a staggered order a logical unit level.

6 . A method to appoint dice within a memory array, comprising:

issuing a read status as a first command;

configuring a volume with Feature 58h before a first FFh;

configuring one or more logical units within the volume; and

issuing the first FFh.

7 . A method as claimed in claim 6 , wherein the first FFh issued will accepted only from an appointed logical unit within the configured volume.

8 . A method as claimed in claim 6 , further comprising appointing a first die in another volume as part of the configured volume.

9 . A method as claimed in claim 6 , further comprising powering one or more dice in a staggered order in the volume or in another volume, or a combination thereof, at a logical unit level.

10 . A method as claimed in claim 6 , wherein one or more dice within the configured volume and one or more device within another volume may be initialized in any selected order.

11 . A solid state drive (SSD), comprising:

a host interface to couple to a processor via the host interface;

control logic coupled to the host interface; and

a memory array coupled to the control logic, wherein the memory array comprises:

two or more volumes, the volumes comprising two or more dice, respectively;

wherein the volumes are connected in a daisy chain configuration such that an output of a first volume is coupled to an input of a next volume; and

wherein the dice are connected in a daisy chain configuration such that an output of a first die is coupled to an input of a next die within the volume.

12 . A solid state drive as claimed in claim 11 , wherein the volumes are disposed in a stacked configuration.

13 . A solid state drive as claimed in claim 11 , wherein the daisy chain configuration of the dice is part of the daisy chain configuration of the volumes such that an input of a volume is coupled to an input of a first die within the volume and an output of a last die of the volume is coupled to an output of the volume.

14 . A solid state drive as claimed in claim 11 , wherein a first die in a first volume is capable of being appointed as part of a second volume.

15 . A solid state drive as claimed in claim 11 , wherein the dice may be powered up in a staggered order a logical unit level.

16 . An article of manufacture comprising a non-transitory machine-readable medium having instructions stored thereon to appoint dice within a memory array that, if executed, result in:

issuing a read status as a first command;

configuring a volume with Feature 58h before a first FFh;

configuring one or more logical units within the volume; and

issuing the first FFh.

17 . An article of manufacture as claimed in claim 6 , wherein the first FFh issued will accepted only from an appointed logical unit within the configured volume.

18 . An article of manufacture as claimed in claim 6 , wherein the instructions, if executed, further result in appointing a first die in another volume as part of the configured volume.

19 . An article of manufacture as claimed in claim 6 , wherein the instructions, if executed, further result in powering one or more dice in a staggered order in the volume or in another volume, or a combination thereof, at a logical unit level.

20 . An article of manufacture as claimed in claim 6 , wherein one or more dice within the configured volume and one or more device within another volume may be initialized in any selected order

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2023
From: INTEL CORPORATION
To: INTEL NDTM US LLC
Reel/Frame 064928/0832 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2014
From: SICILIANI, UMBERTO; RIZZO, GUIDO LUCIANO; CARMINATI, MARCO
To: INTEL CORPORATION
Reel/Frame 033819/0660 →