IP Library › Granted Patent US 9,812,258
Granted Patent B2
US 9,812,258 · App. 14/484,389 · Granted Nov 7, 2017

Ceramic electronic component

Inventors: Takashi Omori (Nagaokakyo, JP); Seiji Koga (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01G4/008H01G4/228H01G4/232H01G4/2325H01G4/30
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Quick Facts
Patent No.
US 9,812,258
App. No.
14/484,389
Granted
Nov 7, 2017
Kind
B2
Abstract

A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).

Claims (13)

1. A ceramic electronic component comprising:

a ceramic body having opposed end portions; and

outer electrodes each respectively covering one of the opposed end portions of the ceramic body, each outer electrode including:

an end-surface portion;

a side-surface turnover portion; and

a glass layer in contact with the ceramic body in a region within at least 5 μm in linear distance from a covering end portion of the side-surface turnover portion and extending in a direction toward the end-surface portion, and which contains, at least, Si, wherein

the glass layer is non-conductive;

an average thickness of the glass layer is 3 μm to 10 μm; and

a content of the Si in the glass layer is 11% to 40% by weight.

2. The ceramic electronic component according to claim 1 , further comprising at least a first plated coating including a Ni-based coating mainly containing Ni on the outer electrodes.

3. The ceramic electronic component according to claim 2 , further comprising at least a second plated coating including a Sn-based coating on the first plated coating.

4. The ceramic electronic component according to claim 1 , further comprising inner electrodes within the ceramic body.

5. The ceramic electronic component according to claim 1 , wherein a material of the glass layer is selected from the group consisting of a Si—B glass material, a Si—B-A glass material, wherein A is an alkali metal, a Si—B—Bi glass material, a Si—B—Zn glass material, and a Si—B—Zr—Ti glass material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2014
From: OMORI, TAKASHI; KOGA, SEIJI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 033773/0960 →
Priority Claims (1)
JP 2012-061568 · Mar 19, 2012 · national
Continuity (2)
Continuation PCTJP2013053691 · Feb 15, 2013
Related Publication 20140376155A1 · Dec 25, 2014