Electronic component and method for manufacturing the same

1. An electronic component comprising:

an element assembly in which inner electrodes are embedded and including a pair of main surfaces, a pair of side surfaces respectively connecting the main surfaces, and a pair of end surfaces respectively perpendicular or substantially perpendicular to the pair of main surfaces and the pair of side surfaces; and

an outer electrode provided on a surface of the element assembly and electrically connected with the inner electrodes; wherein

the outer electrode includes a sintered layer including a sintered metal, an insulation layer including an electric insulation material, and a Sn-containing layer including Sn;

the sintered layer extends from each of the end surfaces onto at least one of the main surfaces so as to cover each of the end surfaces;

the insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to the side surfaces and constitutes a portion of a surface of the outer electrode; and

the Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer and constitutes another portion of the surface of the outer electrode.

2. The electronic component according to claim 1 , wherein the Sn-containing layer extends from each of the end surfaces to one of the main surfaces.

3. The electronic component according to claim 2 , wherein none of the inner electrodes are located in a virtual plane that links a position of an edge of the insulation layer at the end surface on one of the main surfaces with a position of a tip of the outer electrode on one of the main surfaces in a shortest distance.

4. The electronic component according to claim 2 , wherein the insulation layer is directly provided on the sintered layer at each of the end surfaces so that at least a portion of the insulation layer is located between one of the main surfaces and a position of an edge portion of the inner electrode closest to one of the main surfaces in a direction perpendicular or substantially perpendicular to the main surface.

5. The electronic component according to claim 1 , wherein

the sintered layer extends from each of the end surfaces onto each of the side surfaces; and

the insulation layer is provided directly on the sintered layer at each of the side surfaces so as to extend in a direction perpendicular or substantially perpendicular to the end surface.

6. The electronic component according to claim 1 , wherein

the outer electrode further includes a reinforcement layer containing Ni or Cu; and

the reinforcement layer is provided between the sintered layer and the Sn-containing layer.

7. The electronic component according to claim 6 , wherein

the outer electrode further includes a base layer which is made of a material different from a material of the reinforcement layer and contains Cu or Ni; and

the base layer is provided between the sintered layer and the reinforcement layer.

8. The electronic component according to claim 1 , wherein the electronic component is one of a ceramic capacitor, a piezoelectric component, a thermistor, and an inductor.