Electronic component and method for manufacturing the same
In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.
1. An electronic component comprising:
an element assembly in which inner electrodes are embedded and including a pair of main surfaces, a pair of side surfaces respectively connecting the main surfaces, and a pair of end surfaces respectively perpendicular or substantially perpendicular to the pair of main surfaces and the pair of side surfaces; and
an outer electrode provided on a surface of the element assembly and electrically connected with the inner electrodes; wherein
the outer electrode includes a sintered layer containing a sintered metal, a reinforcement layer that does not contain Sn but includes Cu or Ni, an insulation layer including an electric insulation material, and a Sn-containing layer including Sn;
the sintered layer extends from each of the end surfaces onto at least one of the main surfaces so as to cover each of the end surfaces;
the reinforcement layer covers an entirety of the sintered layer;
the insulation layer is directly provided on the reinforcement layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to the side surfaces and defines a portion of a surface of the outer electrode; and
the Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer and defines another portion of the surface of the outer electrode.
2. The electronic component according to claim 1 , wherein the Sn-containing layer extends from each of the end surfaces to one of the main surfaces.
3. The electronic component according to claim 2 , wherein none of the inner electrodes are located in a virtual plane that links a position of an edge of the insulation layer at an end surface on one of the main surfaces with a position of a tip of the outer electrode on one of the main surfaces in a shortest distance.
4. The electronic component according to claim 2 , wherein the insulation layer is provided on the reinforcement layer at each of the end surfaces so that at least a portion of the insulation layer is located between one of the main surfaces and a position of an edge portion of the inner electrode closest to one of the main surfaces in a direction perpendicular or substantially perpendicular to the main surface.
5. The electronic component according to claim 1 , wherein
the sintered layer extends from each of the end surfaces onto each of the side surfaces; and
the insulation layer is provided on the reinforcement layer at each of the side surfaces so as to extend in a direction perpendicular or substantially perpendicular to the end surface.
6. The electronic component according to claim 1 , wherein
the outer electrode further includes a base layer which is made of a material different from a material of the reinforcement layer and contains Cu or Ni; and
the base layer is provided between the sintered layer and the reinforcement layer so as to cover the entirety of the sintered layer.
7. The electronic component according to claim 1 , wherein
the outer electrode further includes a shield layer which is made of a material different from a material of the reinforcement layer and contains Cu or Ni; and
the shield layer is provided between the reinforcement layer and the Sn-containing layer.
8. The electronic component according to claim 1 , wherein the electronic component is one of a ceramic capacitor, a piezoelectric component, a thermistor, and an inductor.