Image pickup element, method of manufacturing image pickup element, and electronic apparatus
An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
1. An imaging device comprising:
a semiconductor substrate having a first side and a second side;
a photoelectric conversion section disposed in the semiconductor substrate;
a pixel separation groove disposed in the semiconductor substrate and adjacent to the photoelectric conversion section;
a plurality of insulating films disposed adjacent to the first side of the semiconductor substrate and inside of the pixel separation groove; and
at least one other film that includes at least one member of the group consisting of silicon nitride, silicon oxide, and silicon oxynitride,
wherein,
each insulating film of the plurality of insulating films includes at least one member of the group consisting of hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide,
a thickness of at least one of the plurality of insulating films is greater than or equal to 10 nm and less than or equal to 80 nm,
the at least one other film contacts a surface of a first insulating film of the plurality of insulating films and a surface of a second insulating film of the plurality of insulating films, and
the first insulating film of the plurality of insulating films and the second insulating film of the plurality of insulating films are made of a same material.
2. The imaging device according to claim 1 , wherein the first insulating film of the plurality of insulating films has a number of layers that is different from the second insulating film of the plurality of insulating films.
3. The imaging device according to claim 1 , wherein the first insulating film of the plurality of insulating films and the second insulating film of the plurality of insulating films are formed in order from the first side of the semiconductor side.
4. The imaging device according to claim 1 , wherein the second insulating film of the plurality of insulating films is contiguous from a light-receiving surface side of the semiconductor substrate to a part of a wall surface of the pixel separation groove.
5. The imaging device according to claim 1 , wherein the at least one other film is a protective film in the pixel separation groove.
6. The imaging device according to claim 1 , wherein a thickness of the first insulating film of the plurality of insulating films is greater than or equal to 2 nm and less than or equal to 100 nm.
7. The imaging device according to claim 1 , wherein the first insulating film of the plurality of insulating films includes portions disposed between the semiconductor substrate and the second insulating film of the plurality of insulating films.
8. The imaging device according to claim 1 , wherein the first insulating film of the plurality of insulating films and the second insulating film of the plurality of insulating films include silicon.
9. The electronic apparatus according to claim 8 , wherein the first insulating film and the second insulating film are different in a number of layers.
10. The electronic apparatus according to claim 8 , wherein the first insulating film and the second insulating film are formed in order from the semiconductor substrate side.
11. The electronic apparatus according to claim 8 , wherein the second insulating film is contiguous from the light-receiving surface to a part of the wall surface of the pixel separation groove.
12. The electronic apparatus according to claim 8 , wherein the at least one other film is a protective film in the pixel separation groove.
13. The electronic apparatus according to claim 8 , wherein a thickness of the first insulating film is greater than or equal to 2 nm and less than or equal to 100 nm.
14. The electronic apparatus according to claim 8 , wherein the first insulating film includes portions disposed between the semiconductor substrate and the second insulating film.
15. The electronic apparatus according to claim 8 , wherein the first insulating film and the second insulating film include silicon.
16. An electronic apparatus provided with an imaging device comprising:
a semiconductor substrate having a first side and a second side;
a photoelectric conversion section disposed in the semiconductor substrate;
a pixel separation groove disposed in the semiconductor substrate and adjacent to the photoelectric conversion section;
a plurality of insulating films disposed adjacent to the first side of the semiconductor substrate and inside of the pixel separation groove, the plurality of insulating films including a first insulating film and a second insulating film; and
at least one other film that includes at least one member of the group consisting of silicon nitride, silicon oxide, and silicon oxynitride,
wherein,
the first insulating film and the second insulating film are made of the same material and include at least one member of the group consisting of hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide,
a thickness of the second insulating film is greater than or equal to 10 nm and less than or equal to 80 nm, and
the at least one other film contacts a surface of the first insulating film and a surface of the second insulating film.