High thermal stability reference structure with out-of-plane anisotropy for magnetic device applications
View Patent ↗Enhanced Hc and Hk in addition to higher thermal stability up to at least 400° C. are achieved in magnetic devices by adding dusting layers on top and bottom surfaces of a spacer in a synthetic antiferromagnetic (SAF) structure to give a RL1/DL1/spacer/DL2/RL2 reference layer configuration where RL1 and RL2 layers exhibit perpendicular magnetic anisotropy (PMA), the spacer induces antiferromagnetic coupling between RL1 and RL2, and DL1 and DL2 are dusting layers that enhance PMA. Dusting layers are deposited at room temperature to 400° C. RL1 and RL2 layers are selected from laminates such as (Ni/Co)n, L1 0 alloys, or rare earth-transition metal alloys. The reference layer may be incorporated in STT-MRAM memory elements or in spintronic devices including a spin transfer oscillator. Dusting layers and a similar SAF design may be employed in a free layer for Ku enhancement and to increase the retention time of a memory cell for STT-MRAM designs.
1. A multilayer stack having a thermal stability to at least 400° C. in a magnetic device, comprising:
(a) a seed layer formed on a substrate; and
(b) a dual synthetic antiferromagnetic (SAF) reference layer formed on the seed layer, the dual SAF reference layer comprises:
(1) a first reference (RL1) layer and a second reference (RL2) layer each exhibiting perpendicular magnetic anisotropy;
(2) a first spacer that induces RKKY (antiferromagnetic) coupling between the RL1 and RL2 layers;
(3) a first dusting layer (DL1) and a second dusting layer (DL2) that enhance the RKKY coupling between the RL1 and RL2 layers, DL1 and DL2 have a CoTa, CoZr, CoHf, CoMg, or CoNb composition;
(4) a third reference layer (RL3) formed as the uppermost layer in the multilayer stack wherein the RL1, RL2, and RL3 layers are made of a laminate that is (Ni/CoFe)n, (Ni/CoFeB)n, (NiFe/Co)n, (NiFeB/Co)n, or (NiCo/Co)n and n is a number of laminations;
(5) a second spacer that induces RKKY coupling between the RL3 and RL2 layers;
(6) third (DL3) and fourth (DL4) dusting layers that enhance RKKY coupling between the RL2 and RL3 layers, the multilayer stack has a configuration in which RL1, DL1, first spacer, DL2, RL2, DL3, second spacer, DL4, and RL3 layers are consecutively deposited on the seed layer to give a configuration represented by seed/RL1/DL1/first spacer/DL2/RL2/DL3/second spacer/DL4/RL3.
2. The multilayer stack of claim 1 wherein n is between about 2 and 30.
3. The multilayer stack of claim 1 wherein the first spacer and the second spacer are one of Ru, Rh, Ir, Cu, or Cr and each of the first spacer and second spacer has a thickness from about 2 to 20 Angstroms.
4. The multilayer stack of claim 1 wherein the DL1, DL2, DL3, and DL4 dusting layers are a Co rich alloy having a Co content greater than 50 atomic %.
5. A multilayer stack having a thermal stability to at least 400° C. in a magnetic device, comprising:
(a) a seed layer formed on a substrate;
(b) a first reference (RL1) layer and a second reference (RL2) layer each exhibiting perpendicular magnetic anisotropy wherein one of the RL1 and RL2 layers is (NiFeB/Co)n and the other of the R1 and R2 layers is made of a laminate that is (Ni/CoFeB)n, or (NiFeB/Co)n where n is the number of laminations that is between 2 and 30;
(c) a spacer that induces RKKY (antiferromagnetic) coupling between the RL1 and RL2 layers; and
(d) a first dusting layer (DL1) and a second dusting layer (DL2) that enhance the RKKY coupling between the RL1 and RL2 layers, the multilayer stack has a configuration in which RL1, DL1, spacer, DL2, and RL2 layers are consecutively deposited on the seed layer to give a seed/RL1/DL1/spacer/DL2/RL2 configuration.
6. The multilayer stack of claim 5 wherein the spacer is Ru, Rh, Ir, Cu, or Cr and has a thickness from about 2 to 20 Angstroms.
7. The multilayer stack of claim 5 wherein the DL1 and DL2 dusting layers are made of Co, CoFe, or a Co alloy.
8. The multilayer stack of claim 5 wherein the seed layer is comprised of NiCr, Ta, Pd, Pt, or Ru.
9. The multilayer stack of claim 5 further comprised of a free layer, and a non-magnetic second spacer that is formed between the free layer and the RL2 layer.
10. The multilayer stack of claim 9 wherein the free layer has a second multilayer stack with a FL1/DL5/third spacer/DL6/FL2 configuration wherein FL1 and FL2 are ferromagnetic layers that exhibit PMA, the third spacer induces RKKY coupling between the FL1 and FL2 layers, and DL5 and DL6 are dusting layers that enhance the RKKY coupling between the FL1 and FL2 layers.